المؤلفون: Yang, G., Yu, Z., Tian, H., Huang, T., Xu, Y., Sun, H., Sun, W., Wu, W.

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المصدر: 2021 International Conference on IC Design and Technology (ICICDT) IC Design and Technology (ICICDT), 2021 International Conference on. :1-4 Sep, 2021

Relation: 2021 International Conference on IC Design and Technology (ICICDT)

المؤلفون: Yang, G., Li, M., Yu, Z., Xu, Y., Sun, H., Liu, S., Sun, W., Wu, W.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 68(9):4462-4466 Sep, 2021

المؤلفون: Mingjie Zhao, Jiahao Yan, Yaotian Wang, Qizhen Chen, Rongjun Cao, Hua Xu, Dong-Sing Wuu, Wan-Yu Wu, Feng-Min Lai, Shui-Yang Lien, Wenzhang Zhu

المصدر: Nanomaterials, Vol 14, Iss 8, p 690 (2024)

مصطلحات موضوعية: α-IGZO, thin-film transistor (TFT), HiPIMS, two-step deposition pressure, room-temperature fabrication, Chemistry, QD1-999

وصف الملف: electronic resource

Relation: https://www.mdpi.com/2079-4991/14/8/690; https://doaj.org/toc/2079-4991

URL الوصول: https://doaj.org/article/f1e593b8d6de457a9414f29f81bdbaf3

المؤلفون: Huang, X.D., Song, J.Q., Lai, P.T.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 63(5):1899-1903 May, 2016

المؤلفون: Chen, F.-H., Chen, C.-H., Pan, T.-M.

المصدر: IEEE Transactions on Dielectrics and Electrical Insulation IEEE Trans. Dielect. Electr. Insul. Dielectrics and Electrical Insulation, IEEE Transactions on. 22(3):1337-1342 Jun, 2015

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لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل.

المؤلفون: Xiyue Li, Bin Li, Ruohe Yao

المصدر: 2013 IEEE International Conference of Electron Devices and Solid-state Circuits Electron Devices and Solid-State Circuits (EDSSC), 2013 IEEE International Conference of. :1-2 Jun, 2013

Relation: 2013 IEEE International Conference of Electron Devices and Solid-State Circuits (EDSSC)

المؤلفون: Her, J., Chen, F., Li, W., Pan, T.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 62(5):1659-1662 May, 2015