المؤلفون: Pandey, S., Sethi, S., Panda, P.R.

المصدر: IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst. Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on. 43(8):2263-2276 Aug, 2024

المؤلفون: Lee, K.-W., Tanikawa, S., Murugesan, M., Naganuma, H., Bea, J.-C., Fukushima, T., Tanaka, T., Koyanagi, M.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 61(2):379-385 Feb, 2014

المؤلفون: Lee, K., Tanikawa, S., Murugesan, M., Naganuma, H., Shimamoto, H., Fukushima, T., Tanaka, T., Koyanagi, M.

المصدر: IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 34(8):1038-1040 Aug, 2013

المؤلفون: Lin, S., Lin, J.

المصدر: IEEE Access Access, IEEE. 5:5566-5577 2017

المؤلفون: Lee, Kang-Wook, Bea, Ji-Chel, Murugesan, Mariappan, Fukushima, Takafumi, Tanaka, Tetsu, Koyanagi, Mitsumasa

المصدر: 2015 IEEE International Reliability Physics Symposium Reliability Physics Symposium (IRPS), 2015 IEEE International. :4C.2.1-4C.2.6 Apr, 2015

Relation: 2015 IEEE International Reliability Physics Symposium (IRPS)

المؤلفون: Shu-Yen Lin, Jin-Yi Lin

المصدر: IEEE Access, Vol 5, Pp 5566-5577 (2017)

مصطلحات موضوعية: 3-D DRAM, thermal-aware mapping, hotspot, Electrical engineering. Electronics. Nuclear engineering, TK1-9971

وصف الملف: electronic resource

Relation: https://ieeexplore.ieee.org/document/7891039/; https://doaj.org/toc/2169-3536

URL الوصول: https://doaj.org/article/ac423f7e6d024723abc927691da7880a

المؤلفون: Jin-Yi Lin, Shu-Yen Lin

المصدر: IEEE Access, Vol 5, Pp 5566-5577 (2017)

مصطلحات موضوعية: 010302 applied physics, Random access memory, General Computer Science, Computer science, General Engineering, 02 engineering and technology, Parallel computing, Function (mathematics), 3-D DRAM, 01 natural sciences, CAS latency, 020202 computer hardware & architecture, Memory management, Feature (computer vision), 0103 physical sciences, Thermal, 0202 electrical engineering, electronic engineering, information engineering, Electronic engineering, General Materials Science, hotspot, lcsh:Electrical engineering. Electronics. Nuclear engineering, thermal-aware mapping, lcsh:TK1-9971, Dram

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::2b1bccb7d0327a9990059a85634f1dd5
https://doi.org/10.1109/access.2017.2690323

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