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1
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2دورية أكاديمية
المؤلفون: Pahwa, G., Salahuddin, S., Hu, C.
المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 71(8):4701-4709 Aug, 2024
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3
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4مؤتمر
المؤلفون: Vici, Andrea, Degraeve, Robin, Horiguchi, Naoto, De Wolf, Ingrid, Franco, Jacopo
المصدر: 2024 IEEE International Reliability Physics Symposium (IRPS) International Reliability Physics Symposium (IRPS), 2024 IEEE. :1-6 Apr, 2024
Relation: 2024 IEEE International Reliability Physics Symposium (IRPS)
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5
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6دورية أكاديمية
المؤلفون: Ortega, E., Talukdar, J., Paik, W., Bletsch, T., Chakrabarty, K.
المصدر: IEEE Transactions on Very Large Scale Integration (VLSI) Systems IEEE Trans. VLSI Syst. Very Large Scale Integration (VLSI) Systems, IEEE Transactions on. 32(5):967-971 May, 2024
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7دورية أكاديمية
المؤلفون: Li, F.
المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 14(4):705-713 Apr, 2024
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8دورية أكاديمية
المؤلفون: Schulze, S., VoB, T., Kruger, P., Wietstruck, M.
المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 14(3):519-524 Mar, 2024
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9دورية أكاديمية
المؤلفون: Oh, S., Zheng, T., Bakir, M.S.
المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 14(2):202-210 Feb, 2024
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10دورية أكاديمية
المؤلفون: Kiran, K.M., Kaushik, B.K., Dhiman, R.
المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 14(2):267-276 Feb, 2024