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1دورية أكاديمية
المؤلفون: Jouni, A., Mamdy, B., Malherbe, V., Lalucaa, V., Virmontois, C., Gasiot, G., Goiffon, V.
المصدر: IEEE Transactions on Nuclear Science IEEE Trans. Nucl. Sci. Nuclear Science, IEEE Transactions on. 71(8):1753-1765 Aug, 2024
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2دورية أكاديمية
المؤلفون: Nair, G.R., Nalla, P.S., Krishnan, G., Anupreetham, ., Oh, J., Hassan, A., Yeo, I., Kasichainula, K., Seok, M., Seo, J., Cao, Y.
المصدر: IEEE Solid-State Circuits Letters IEEE Solid-State Circuits Lett. Solid-State Circuits Letters, IEEE. 7:119-122 2024
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3مؤتمر
المؤلفون: Jain, Aakrati, Miyazawa, Risa, Raghavan, Sathya, Chowdhury, Prabudhya Roy, Farooq, Mukta Ghate, Kumar, Arvind, Sakuma, Katsuyuki
المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :1219-1225 May, 2023
Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
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4دورية أكاديمية
المؤلفون: Erdogan, A.T., Al Abbas, T., Finlayson, N., Hopkinson, C., Gyongy, I., Almer, O., Dutton, N.A.W., Henderson, R.K.
المصدر: IEEE Journal of Solid-State Circuits IEEE J. Solid-State Circuits Solid-State Circuits, IEEE Journal of. 57(6):1649-1660 Jun, 2022
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5دورية أكاديمية
المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 69(3):1600-1603 Mar, 2022
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6دورية أكاديمية
المؤلفون: Gundu, A.K., Kursun, V.
المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 69(3):922-929 Mar, 2022
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7دورية أكاديمية
المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 12(1):51-58 Jan, 2022
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8دورية أكاديمية
المصدر: IEEE Open Journal of the Solid-State Circuits Society IEEE Open J. Solid-State Circuits Soc. Solid-State Circuits Society, IEEE Open Journal of the. 2:3-11 2022
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9دورية أكاديمية
المصدر: IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst. Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on. 40(8):1586-1599 Aug, 2021
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10دورية أكاديمية
المؤلفون: Hou, L., Derakhshandeh, J., Beyne, E., De Wolf, I.
المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 10(1):30-38 Jan, 2020