يعرض 1 - 10 نتائج من 466 نتيجة بحث عن '"3D ICs"', وقت الاستعلام: 1.00s تنقيح النتائج
  1. 1
    مؤتمر
    Study on Compact Thermal Model for 3D Interlayer Electronic Cooling Based on Fluid-Solid Coupling Heat Transfer

    المؤلفون: Cao, Zhizhu, Tao, Jun, Xu, Run, Li, Jiming, Chen, Yu

    المصدر: 2024 2nd International Symposium of Electronics Design Automation (ISEDA) Electronics Design Automation (ISEDA), 2024 2nd International Symposium of. :600-604 May, 2024

    Relation: 2024 2nd International Symposium of Electronics Design Automation (ISEDA)

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  2. 2
    دورية أكاديمية
    Modeling and Design of Dual-Purpose MIV in Monolithic 3D IC

    المؤلفون: Vemuri, M.S., Tida, U.R.

    المصدر: IEEE Access Access, IEEE. 12:23066-23080 2024

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  3. 3
    مؤتمر
    HyPlace-3D: A Hybrid Placement Approach for 3D ICs Using Space Transformation Technique

    المؤلفون: Lin, Jai-Ming, Lin, Yu-Chien, Kung, Hsuan, Lin, Wei-Yuan

    المصدر: 2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD) Computer Aided Design (ICCAD), 2023 IEEE/ACM International Conference on. :1-8 Oct, 2023

    Relation: 2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD)

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  4. 4
    مؤتمر
    Learning Peak Temperature in 3DICs by Deep Differentiable Forest

    المؤلفون: Chen, Yingshi, Zhu, Min, Zhang, Xueyin, Zhai, Yusheng, Feng, Chunyang

    المصدر: 2024 2nd International Symposium of Electronics Design Automation (ISEDA) Electronics Design Automation (ISEDA), 2024 2nd International Symposium of. :761-762 May, 2024

    Relation: 2024 2nd International Symposium of Electronics Design Automation (ISEDA)

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  5. 5
    مؤتمر
    Efficient and Scalable MIV-Transistor with Extended Gate in Monolithic 3D Integration

    المؤلفون: Vemuri, Madhava Sarma, Tida, Umamaheswara Rao

    المصدر: 2023 IEEE 66th International Midwest Symposium on Circuits and Systems (MWSCAS) Circuits and Systems (MWSCAS), 2023 IEEE 66th International Midwest Symposium on. :187-191 Aug, 2023

    Relation: 2023 IEEE 66th International Midwest Symposium on Circuits and Systems (MWSCAS)

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  6. 6
    مؤتمر
    3D Compact Thermal Model and its Application on Fast Chip Level Thermal Simulation

    المؤلفون: Cao, Zhizhu, Li, Jiming, Tao, Jun, Chen, Yu

    المصدر: 2023 International Symposium of Electronics Design Automation (ISEDA) Electronics Design Automation (ISEDA), 2023 International Symposium of. :246-249 May, 2023

    Relation: 2023 International Symposium of Electronics Design Automation (ISEDA)

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  7. 7
    مؤتمر
    Thermal Stress Effect on 3D Integrated Circuit Performance and Reliability

    المؤلفون: Alzahmi, Ahmed

    المصدر: 2023 3rd International Conference on Computing and Information Technology (ICCIT) Computing and Information Technology (ICCIT), 2023 3rd International Conference on. :462-464 Sep, 2023

    Relation: 2023 3rd International Conference on Computing and Information Technology (ICCIT)

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  8. 8
    دورية أكاديمية
    Impact of Inherent Design Limitations for Cu–Sn SLID Microbumps on Its Electromigration Reliability for 3D ICs

    المؤلفون: Tiwary, N., Ross, G., Vuorinen, V., Paulasto-Krockel, M.

    المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 70(1):222-229 Jan, 2023

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  9. 9
    مؤتمر
    TSV BIST Repair: Design-For-Test Challenges and Emerging Solution for 3D Stacked IC's

    المؤلفون: Sankararao, Akkapolu, G, Vaishnavi, Malige, Sandya Rani

    المصدر: 2022 IEEE International Test Conference India (ITC India) Test Conference India (ITC India), 2022 IEEE International. :1-6 Jul, 2022

    Relation: 2022 IEEE International Test Conference India (ITC India)

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  10. 10
    مؤتمر
    A Placement-Oriented Mitigation Technique for Single Event Effect in Monolithic 3D IC

    المؤلفون: Azimi, Sarah, De Sio, Corrado, Sterpone, Luca

    المصدر: 2022 18th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD) Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD), 2022 18th International Conference on. :1-4 Jun, 2022

    Relation: 2022 18th International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD)

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