المؤلفون: Pahwa, Ramanpreet Singh, Chang, Richard, Jie, Wang, Ziyuan, Zhao, Lile, Cai, Xun, Xu, Sheng, Foo Chuan, Choong, Chong Ser, Rao, Vempati Srinivasa

المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :943-950 May, 2023

Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

المؤلفون: Jones, D.R., Brown, P., McFarland, G., Perks, R., Choi, H., Cripps, S., Porch, A.

المصدر: IEEE Journal of Microwaves IEEE J. Microw. Microwaves, IEEE Journal of. 3(3):962-969 Jul, 2023

المؤلفون: Badillo, Pablo D., Jabr, Yara, Parfenov, Vadim A.

المصدر: 2022 XXV International Conference on Soft Computing and Measurements (SCM) Soft Computing and Measurements (SCM), 2022 XXV International Conference on. :10-14 May, 2022

Relation: 2022 XXV International Conference on Soft Computing and Measurements (SCM)

المؤلفون: Badillo, Pablo D., Parfenov, Vadim A., Kuleshov, Dmitry S.

المصدر: 2022 Conference of Russian Young Researchers in Electrical and Electronic Engineering (ElConRus) Russian Young Researchers in Electrical and Electronic Engineering (ElConRus), 2022 Conference of. :1098-1102 Jan, 2022

Relation: 2022 Conference of Russian Young Researchers in Electrical and Electronic Engineering (ElConRus)

المؤلفون: Badillo, Pablo D., Parfenov, Vadim A.

المصدر: 2022 Conference of Russian Young Researchers in Electrical and Electronic Engineering (ElConRus) Russian Young Researchers in Electrical and Electronic Engineering (ElConRus), 2022 Conference of. :1103-1106 Jan, 2022

Relation: 2022 Conference of Russian Young Researchers in Electrical and Electronic Engineering (ElConRus)

المؤلفون: Pahwa, Ramanpreet Singh, Lay Nwe, Ma Tin, Chang, Richard, Min, Oo Zaw, Jie, Wang, Gopalakrishnan, Saisubramaniam, Soon Wee, David Ho, Qin, Ren, Rao, Vempati Srinivasa, Dai, Haiwen, Neumann, Jens Timo, Pichumani, Ramani, Gregorich, Tom

المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :2196-2204 Jun, 2021

Relation: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

المؤلفون: Pahwa, Ramanpreet S, Ho, Soon Wee, Qin, Ren, Chang, Richard, Min, Oo Zaw, Jie, Wang, Rao, Vempati Srinivasa, Nwe, Tin Lay, Yang, Yanjing, Neumann, Jens Timo, Pichumani, Ramani, Gregorich, Thomas

المصدر: 2020 International Wafer Level Packaging Conference (IWLPC) Wafer Level Packaging Conference (IWLPC), 2020 International. :01-07 Oct, 2020

Relation: 2020 International Wafer Level Packaging Conference (IWLPC)

المؤلفون: Shi, Shengxian^Aff3, Quinn, Mark Kenneth^Aff4

المساهمون: Shi, Shengxian, editor^Aff1, New, T. H., editor^Aff2

المصدر: Development and Application of Light-Field Cameras in Fluid Measurements. :115-128

المؤلفون: Zhang, Xiaoxiao, Karakoy, Mert, Wu, Kejia, Chen, Zhuangfei, Ge, Zhenhua, Krishnan, Navi, Siany, Amit, Levi, Shimon, Schwarzband, Ishai, Kris, Roman

المصدر: 2018 29th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) SEMI Advanced Semiconductor Manufacturing Conference (ASMC), 2018 29th Annual. :320-323 Apr, 2018

Relation: 2018 29th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)

المؤلفون: Guidi, Gabriele, Malik, Umair Shafqat, Frischer, Bernard, Barandoni, Cristiana, Paolucci, Fabrizio

المصدر: 2017 23rd International Conference on Virtual System & Multimedia (VSMM) Virtual System & Multimedia (VSMM) , 2017 23rd International Conference on. :1-8 Oct, 2017

Relation: 2017 23rd International Conference on Virtual System & Multimedia (VSMM)