المؤلفون: Sagar Shrestha, Sajjan Parajuli, Jinhwa Park, Hao Yang, Tae-Yeon Cho, Ji-Ho Eom, Seong-Keun Cho, Jongsun Lim, Gyoujin Cho, Younsu Jung

المصدر: Nanomaterials, Vol 13, Iss 3, p 559 (2023)

مصطلحات موضوعية: roll to roll, PECVD, passivation, threshold voltage, silicon nitride, 85/85 test, Chemistry, QD1-999

وصف الملف: electronic resource

Relation: https://www.mdpi.com/2079-4991/13/3/559; https://doaj.org/toc/2079-4991

URL الوصول: https://doaj.org/article/f9cf023d7a7f4c9f8351813083f33407

المؤلفون: Putaala, J., Niittynen, J., Hannu, J., Myllymaki, S., Kunnari, E., Mantysalo, M., Hagberg, J., Jantunen, H.

المصدر: IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 17(2):281-290 Jun, 2017

لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل.

المؤلفون: Esa Kunnari, Matti Mäntysalo, Heli Jantunen, Sami Myllymäki, Juha Niittynen, Juha Hagberg, Jussi Putaala, Jari Hannu

المساهمون: Tampere University, Electronics and Communications Engineering, Research group: Laboratory for Future Electronics

مصطلحات موضوعية: Materials science, Silicon, Scanning electron microscope, chemistry.chemical_element, 02 engineering and technology, Substrate (printing), interconnections, 0202 electrical engineering, electronic engineering, information engineering, 85/85 test, Electrical and Electronic Engineering, Safety, Risk, Reliability and Quality, Electrical conductor, Interconnection, reliability, Inkwell, business.industry, 213 Electronic, automation and communications engineering, electronics, direct chip attachment, Electrical engineering, 020206 networking & telecommunications, 021001 nanoscience & nanotechnology, Chip, Electronic, Optical and Magnetic Materials, chemistry, inkjet, Optoelectronics, 0210 nano-technology, business, Flip chip

وصف الملف: fulltext; application/pdf

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::a6a24cd4611d1a6131deec93cd2054d5
https://trepo.tuni.fi/handle/10024/126212

مصطلحات الفهرس: 85/85 test, direct chip attachment, inkjet, interconnections, reliability, info:eu-repo/semantics/article, info:eu-repo/semantics/acceptedVersion

URL: http://urn.fi/urn:nbn:fi-fe201902225979