المؤلفون: Amano, K., Nakamura, T., Terauchi, N., Ishiyama, A., Ueda, H., Noguchi, S.

المصدر: IEEE Transactions on Applied Superconductivity IEEE Trans. Appl. Supercond. Applied Superconductivity, IEEE Transactions on. 34(5):1-5 Aug, 2024

المؤلفون: Nakamura, Fumi, Suzuki, Kenta, Noriki, Akihiro, Suda, Satoshi, Kurosu, Takayuki, Amano, Takeru

المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1404-1408 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

المؤلفون: Noriki, Akihiro, Uemura, Hirotaka, Kuwatsuka, Haruhiko, Matsui, Naoki, Motoii, Reona, Maeda, Dan, Sugita, Tomoya, Nakamura, Fumi, Suda, Satoshi, Kurosu, Takayuki, Amano, Takeru

المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :96-100 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

المؤلفون: Kojima, Takuya, Yanai, Yosuke, Okuhara, Hayate, Amano, Hideharu, Kuga, Morihiro, Iida, Masahiro

المصدر: 2024 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS) Low-Power and High-Speed Chips (COOL CHIPS), 2024 IEEE Symposium in. :1-6 Apr, 2024

Relation: 2024 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS)

المؤلفون: Lin, Zirui, Itoyama, Katsutoshi, Nakadai, Kazuhiro, Amano, Hideharu

المصدر: 2024 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS) Low-Power and High-Speed Chips (COOL CHIPS), 2024 IEEE Symposium in. :1-6 Apr, 2024

Relation: 2024 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS)

المؤلفون: Sakuma, Shigetomo, Mishima, Yuki, Matsui, Tomkazu, Suwa, Hirohiko, Yasumoto, Keiichi, Amano, Tatsuya, Yamaguchi, Hirozumi

المصدر: 2024 IEEE International Conference on Pervasive Computing and Communications Workshops and other Affiliated Events (PerCom Workshops) Pervasive Computing and Communications Workshops and other Affiliated Events (PerCom Workshops), 2024 IEEE International Conference on. :308-313 Mar, 2024

Relation: 2024 IEEE International Conference on Pervasive Computing and Communications Workshops and other Affiliated Events (PerCom Workshops)

المؤلفون: Sakuma, Shigetomo, Mishima, Yuki, Matsui, Tomkazu, Suwa, Hirohiko, Yasumoto, Keiichi, Amano, Tatsuya, Yamaguchi, Hirozumi

المصدر: 2024 IEEE International Conference on Pervasive Computing and Communications Workshops and other Affiliated Events (PerCom Workshops) Pervasive Computing and Communications Workshops and other Affiliated Events (PerCom Workshops), 2024 IEEE International Conference on. :394-396 Mar, 2024

Relation: 2024 IEEE International Conference on Pervasive Computing and Communications Workshops and other Affiliated Events (PerCom Workshops)

المؤلفون: Matsushima, Yosuke, Iwasaki, Takeshi, Daibou, Tadaomi, Sasaki, Takayuki, Shimoda, Yutaro, Qi, Zhu, Goto, Masakazu, Sato, Yuya, Onizaki, Makoto, Nagamine, Makoto, Amano, Minoru, Kawai, Hiroki, Tokuhira, Hiroki, Chokawa, Kenta, Takashima, Rina, Tsukagoshi, Takayuki, Saitoh, Masumi, Ikeda, Keiji, Komatsu, Katsuyoshi

المصدر: 2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) Electron Devices Technology & Manufacturing Conference (EDTM), 2024 8th IEEE. :1-3 Mar, 2024

Relation: 2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)

المؤلفون: Togawa, Moto, Richter, Jan, Shah, Chintan, Botz, Marc, Nenninger, Joshua, Danisch, Jonas, Goes, Joschka, Kühn, Steffen, Amaro, Pedro, Mohamed, Awad, Amano, Yuki, Orlando, Stefano, Totani, Roberta, de Simone, Monica, Fritzsche, Stephan, Pfeifer, Thomas, Coreno, Marcello, Surzhykov, Andrey, López-Urrutia, José R. Crespo

مصطلحات موضوعية: Physics - Atomic Physics

URL الوصول: http://arxiv.org/abs/2408.12227

المؤلفون: Amano, Tomohito, Yamazaki, Tamio, Tsuneyuki, Shinji

مصطلحات موضوعية: Condensed Matter - Materials Science

URL الوصول: http://arxiv.org/abs/2407.08390