يعرض 1 - 10 نتائج من 166,588 نتيجة بحث عن '"A, Itoh"', وقت الاستعلام: 1.05s تنقيح النتائج
  1. 1
    مؤتمر
    API Management in Digital Health: Exploring IBM API Connect and IBM API Hub in Enabling Healthcare Innovation

    المؤلفون: Siu, Vince S., Buleje, Italo, Itoh, Takashi, Hungund, Anil, Reinen, Jenna, Agurto, Carla, Graziano, Michael, Frohling, Kyle, Dang, Bing, Rogers, Jeffrey

    المصدر: 2024 IEEE International Conference on Digital Health (ICDH) ICDH Digital Health (ICDH), 2024 IEEE International Conference on. :189-195 Jul, 2024

    Relation: 2024 IEEE International Conference on Digital Health (ICDH)

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  2. 2
    دورية أكاديمية
    A Resonant Galvanometer for Noninvasive Passive Wide-Range AC Monitoring

    المؤلفون: Han, H., Wang, D.F., Itoh, T., Maeda, R.

    المصدر: IEEE Transactions on Industrial Electronics IEEE Trans. Ind. Electron. Industrial Electronics, IEEE Transactions on. 71(7):8113-8120 Jul, 2024

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  3. 3
    مؤتمر
    A 28 GHz Band Highly Efficient GaAs Rectenna MMIC with EM Coupling Structure for an External Highly Efficient Wire Antenna

    المؤلفون: Sakai, Naoki, Tondokoro, Yudai, Kobayashi, Akinobu, Noguchi, Keisuke, Tsuru, Masaomi, Itoh, Kenji

    المصدر: 2024 IEEE/MTT-S International Microwave Symposium - IMS 2024 Microwave Symposium - IMS 2024, 2024 IEEE/MTT-S International. :122-125 Jun, 2024

    Relation: 2024 IEEE/MTT-S International Microwave Symposium - IMS 2024

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  4. 4
    مؤتمر
    Microwave and Millimeter Wave Rectennas with Gated Anode Diode and Diode on Antenna Topologies

    المؤلفون: Sakai, Naoki, Tsuru, Masaomi, Noguchi, Keisuke, Itoh, Kenji

    المصدر: 2024 9th International Conference on Integrated Circuits, Design, and Verification (ICDV) Integrated Circuits, Design, and Verification (ICDV), 2024 9th International Conference on. :230-234 Jun, 2024

    Relation: 2024 9th International Conference on Integrated Circuits, Design, and Verification (ICDV)

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  5. 5
    مؤتمر
    Developing MEMS Electric Current Sensors for End-use Monitoring of Power Supply: Part XIII - Analytical Study on Thermoelastic Damping for Structural Optimization Applicable to Resonant Galvanometers

    المؤلفون: Fang, Yifan, Han, Hongxiang, Wang, Xinyu, Ding, Gai, Ouyang, Kainan, Qu, Song, Wang, Dong F., Ono, Takahito, Itoh, Toshihiro

    المصدر: 2024 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2024 Symposium on. :1-5 Jun, 2024

    Relation: 2024 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)

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  6. 6
    مؤتمر
    Oscillation in Coupled Resonator Systems: Part VI - Study on Internal Resonance Sensing from Singe Trace to Multiple Traces with High Sensitivity

    المؤلفون: Chen, Shaokang, Cong, Puyuan, Wang, Dong F., Ono, Takahito, Itoh, Toshihiro

    المصدر: 2024 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2024 Symposium on. :1-4 Jun, 2024

    Relation: 2024 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)

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  7. 7
    مؤتمر
    Modeling of Common-Mode Noise Equivalent Circuit for Solid-State Transformer based on ISOP Configuration

    المؤلفون: Kikuchi, Naoto, Watanabe, Hiroki, Itoh, Jun-Ichi

    المصدر: 2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa) Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa), 2024 IEEE Joint International Symposium on. :380-383 May, 2024

    Relation: 2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa)

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  8. 8
    مؤتمر
    Oblique Incident Reflection Characteristic Evaluation of EM Wave Absorber for 28 GHz Without Metal Backing

    المؤلفون: Kagekawa, Shinnosuke, Itoh, Morimichi, Yamamoto, Shinichiro, Igarashi, Hiroshi

    المصدر: 2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa) Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa), 2024 IEEE Joint International Symposium on. :243-246 May, 2024

    Relation: 2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa)

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  9. 9
    مؤتمر
    Predicting a Critical Transition from Time-series Datasets Generated by LTspice Using a Parameter Space Estimation

    المؤلفون: Itoh, Yoshitaka

    المصدر: 2024 IEEE International Symposium on Circuits and Systems (ISCAS) Circuits and Systems (ISCAS), 2024 IEEE International Symposium on. :1-5 May, 2024

    Relation: 2024 IEEE International Symposium on Circuits and Systems (ISCAS)

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  10. 10
    مؤتمر
    A Study on Hybrid Optimization Methods using Lévy Flight and Differential Evolution Mechanisms

    المؤلفون: Shindo, Takuya, Itoh, Nobuhiko

    المصدر: 2024 IEEE International Symposium on Circuits and Systems (ISCAS) Circuits and Systems (ISCAS), 2024 IEEE International Symposium on. :1-4 May, 2024

    Relation: 2024 IEEE International Symposium on Circuits and Systems (ISCAS)

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