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1مؤتمر
المؤلفون: Siu, Vince S., Buleje, Italo, Itoh, Takashi, Hungund, Anil, Reinen, Jenna, Agurto, Carla, Graziano, Michael, Frohling, Kyle, Dang, Bing, Rogers, Jeffrey
المصدر: 2024 IEEE International Conference on Digital Health (ICDH) ICDH Digital Health (ICDH), 2024 IEEE International Conference on. :189-195 Jul, 2024
Relation: 2024 IEEE International Conference on Digital Health (ICDH)
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2دورية أكاديمية
المؤلفون: Han, H., Wang, D.F., Itoh, T., Maeda, R.
المصدر: IEEE Transactions on Industrial Electronics IEEE Trans. Ind. Electron. Industrial Electronics, IEEE Transactions on. 71(7):8113-8120 Jul, 2024
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3مؤتمر
المؤلفون: Sakai, Naoki, Tondokoro, Yudai, Kobayashi, Akinobu, Noguchi, Keisuke, Tsuru, Masaomi, Itoh, Kenji
المصدر: 2024 IEEE/MTT-S International Microwave Symposium - IMS 2024 Microwave Symposium - IMS 2024, 2024 IEEE/MTT-S International. :122-125 Jun, 2024
Relation: 2024 IEEE/MTT-S International Microwave Symposium - IMS 2024
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4مؤتمر
المؤلفون: Sakai, Naoki, Tsuru, Masaomi, Noguchi, Keisuke, Itoh, Kenji
المصدر: 2024 9th International Conference on Integrated Circuits, Design, and Verification (ICDV) Integrated Circuits, Design, and Verification (ICDV), 2024 9th International Conference on. :230-234 Jun, 2024
Relation: 2024 9th International Conference on Integrated Circuits, Design, and Verification (ICDV)
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5مؤتمر
المؤلفون: Fang, Yifan, Han, Hongxiang, Wang, Xinyu, Ding, Gai, Ouyang, Kainan, Qu, Song, Wang, Dong F., Ono, Takahito, Itoh, Toshihiro
المصدر: 2024 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2024 Symposium on. :1-5 Jun, 2024
Relation: 2024 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)
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6مؤتمر
المؤلفون: Chen, Shaokang, Cong, Puyuan, Wang, Dong F., Ono, Takahito, Itoh, Toshihiro
المصدر: 2024 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2024 Symposium on. :1-4 Jun, 2024
Relation: 2024 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)
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7مؤتمر
المؤلفون: Kikuchi, Naoto, Watanabe, Hiroki, Itoh, Jun-Ichi
المصدر: 2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa) Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa), 2024 IEEE Joint International Symposium on. :380-383 May, 2024
Relation: 2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa)
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8مؤتمر
المصدر: 2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa) Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa), 2024 IEEE Joint International Symposium on. :243-246 May, 2024
Relation: 2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa)
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9مؤتمر
المؤلفون: Itoh, Yoshitaka
المصدر: 2024 IEEE International Symposium on Circuits and Systems (ISCAS) Circuits and Systems (ISCAS), 2024 IEEE International Symposium on. :1-5 May, 2024
Relation: 2024 IEEE International Symposium on Circuits and Systems (ISCAS)
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10مؤتمر
المؤلفون: Shindo, Takuya, Itoh, Nobuhiko
المصدر: 2024 IEEE International Symposium on Circuits and Systems (ISCAS) Circuits and Systems (ISCAS), 2024 IEEE International Symposium on. :1-4 May, 2024
Relation: 2024 IEEE International Symposium on Circuits and Systems (ISCAS)