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1دورية أكاديمية
المؤلفون: Tian, Y, Lin, Y, Qu, CH, Arndt, V, Baurley, JW, Berndt, SI, Bien, SA, Bishop, DT, Brenner, H, Buchanan, DD, Budiarto, A, Campbell, PT, Carreras-Torres, R, Casey, G, Chan, AT, Chen, R, Chen, XC, Conti, DV, Diez-Obrero, V, Dimou, N, Drew, DA, Figueiredo, JC, Gallinger, S, Giles, GG, Gruber, SB, Gunter, MJ, Harlid, S, Harrison, TA, Hidaka, A, Hoffmeister, M, Huyghe, JR, Jenkins, MA, Jordahl, KM, Joshi, AD, Keku, TO, Kawaguchi, E, Kim, AE, Kundaje, A, Larsson, SC, Marchand, LL, Lewinger, JP, Li, L, Moreno, V, Morrison, J, Murphy, N, Nan, HM, Nassir, R, Newcomb, PA, Obon-Santacana, M, Ogino, S, Ose, J, Pardamean, B, Pellatt, AJ, Peoples, AR, Platz, EA, Potter, JD, Prentice, RL, Rennert, G, Ruiz-Narvaez, EA, Sakoda, LC, Schoen, RE, Shcherbina, A, Stern, MC, Su, YR, Thibodeau, SN, Thomas, DC, Tsilidis, KK, van Duijnhoven, FJB, Van Guelpen, B, Visvanathan, K, White, E, Wolk, A, Woods, MO, Wu, AH, Peters, U, Gauderman, WJ, Hsu, L, Chang-Claude, J
المصدر: British journal of cancer. 130(10):1687-1696
مصطلحات موضوعية: Medicin och hälsovetenskap
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2دورية أكاديمية
المؤلفون: Simpson, SJ, Du Berry, C, Evans, DJ, Gibbons, JTD, Vollsaeter, M, Halvorsen, T, Gruber, K, Lombardi, E, Stanojevic, S, Hurst, JR, Um-Bergstrom, P, Hallberg, J, Doyle, LW, Kotecha, S
المصدر: The Lancet. Respiratory medicine. 12(2):167-180
مصطلحات موضوعية: Medicin och hälsovetenskap
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3مؤتمر
المؤلفون: Urban, Peter, Povazay, Boris, Uhrmann, Thomas, Gruber, Michael Josef, Thallner, Bernd, Wimplinger, Markus
المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :415-419 May, 2024
Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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4مؤتمر
المؤلفون: Owen, Herbert, Ernst, Dominik, Gruber, Thomas, Lemkuhl, Oriol, Houzeaux, Guillaume, Gasparino, Lucas, Wellein, Gerhard
المصدر: 2024 IEEE International Parallel and Distributed Processing Symposium (IPDPS) IPDPS Parallel and Distributed Processing Symposium (IPDPS), 2024 IEEE International. :408-416 May, 2024
Relation: 2024 IEEE International Parallel and Distributed Processing Symposium (IPDPS)
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5مؤتمر
المصدر: 2024 IEEE International Parallel and Distributed Processing Symposium (IPDPS) IPDPS Parallel and Distributed Processing Symposium (IPDPS), 2024 IEEE International. :350-360 May, 2024
Relation: 2024 IEEE International Parallel and Distributed Processing Symposium (IPDPS)
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6مؤتمر
المؤلفون: Probst, Matthias, Brosch, Manuel, Gruber, Michael, Sigl, Georg
المصدر: 2024 IEEE International Symposium on Hardware Oriented Security and Trust (HOST) Hardware Oriented Security and Trust (HOST), 2024 IEEE International Symposium on. :112-121 May, 2024
Relation: 2024 IEEE International Symposium on Hardware Oriented Security and Trust (HOST)
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7مؤتمر
المؤلفون: Gruber, Martin, Roslan, Muhammad Firhard, Parry, Owain, Scharnbock, Fabian, McMinn, Phil, Fraser, Gordon
المصدر: 2024 IEEE/ACM 46th International Conference on Software Engineering (ICSE) ICSE Software Engineering (ICSE), 2024 IEEE/ACM 46th International Conference on. :554-565 Apr, 2024
Relation: 2024 IEEE/ACM 46th International Conference on Software Engineering (ICSE)
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8مؤتمر
المؤلفون: Yu, Qiulin, Kamble, Vikram G., Gruber, Dieter P., Fuchs, Peter F., Fendt, Karl, Krivec, Thomas
المصدر: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-12 Apr, 2024
Relation: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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9مؤتمر
المؤلفون: Porathur, Fredy John, Kamble, Vikram G, Stadler, Eduard, Huber, Fabian, Gruber, Dieter P., Fuchs, Peter Filipp
المصدر: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-9 Apr, 2024
Relation: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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10مؤتمر
المصدر: 2024 27th International Symposium on Design & Diagnostics of Electronic Circuits & Systems (DDECS) Design & Diagnostics of Electronic Circuits & Systems (DDECS), 2024 27th International Symposium on. :53-56 Apr, 2024
Relation: 2024 27th International Symposium on Design & Diagnostics of Electronic Circuits & Systems (DDECS)