المؤلفون: Tulzo, Harold Le, Bijou, Diane, Souza, Therese, Gallegos, Anthony, Thomas, Candice, Deschaseaux, Edouard, Feautrier, Celine, Charbonnier, Jean, Gueugnot, Alain, Derakhshandeh, Jaber, Hussain, Tassawar, Daviot, Jerome

المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :378-385 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

المؤلفون: Feautrier, Celine, Deschaseaux, Edouard, Gueugnot, Alain, Charbonnier, Jean, Plihon, Aurelia, Dupre, Ludovic, Henry, Franck, Berger, Frederic, Pagot, Antoine, Renet, Sebastien, Mailliart, Olivier, Thomas, Candice

المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :973-979 May, 2023

Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

المؤلفون: Gasser, Mary-Ann, Mani, Abdenacer Ait, Mourier, Thierry, Gueugnot, Alain, Peray, Patrick, Vanel, Loic, Barentin, Catherine

المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :77-81 May, 2022

Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

المؤلفون: MANI, Abdenacer AIT, CAICEDO, Nohora, MILOUD-ALI, Nadia, LEVY, Francois, BERGER, Frederic, MOURIER, Thierry, CHAIRA, Tarik, APHOZ, Natacha R, BEDOIN, Alexis, PERAY, Patrick, FRANCOU, Mireille, GUEUGNOT, Alain, BOUTAFA, Laura, HENRY, David

المصدر: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) Electronics System-Integration Technology Conference (ESTC), 2020 IEEE 8th. :1-6 Sep, 2020

Relation: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)

المؤلفون: Vivet, P., Guthmuller, E., Thonnart, Y., Pillonnet, G., Fuguet, C., Miro-Panades, I., Moritz, G., Durupt, J., Bernard, C., Varreau, D., Pontes, J., Thuries, S., Coriat, D., Harrand, M., Dutoit, D., Lattard, D., Arnaud, L., Charbonnier, J., Coudrain, P., Garnier, A., Berger, F., Gueugnot, A., Greiner, A., Meunier, Q.L., Farcy, A., Arriordaz, A., Cheramy, S., Clermidy, F.

المصدر: IEEE Journal of Solid-State Circuits IEEE J. Solid-State Circuits Solid-State Circuits, IEEE Journal of. 56(1):79-97 Jan, 2021

المؤلفون: Vivet, Pascal, Guthmuller, Eric, Thonnart, Yvain, Pillonnet, Gael, Moritz, Guillaume, Miro-Panades, Ivan, Fuguet, Cesar, Durupt, Jean, Bernard, Christian, Varreau, Didier, Pontes, Julian, Thuries, Sebastien, Coriat, David, Harrand, Michel, Dutoit, Denis, Lattard, Didier, Arnaud, Lucile, Charbonnier, Jean, Coudrain, Perceval, Garnier, Arnaud, Berger, Frederic, Gueugnot, Alain, Greiner, Alain, Meunier, Quentin, Farcy, Alexis, Arriordaz, Alexandre, Cheramy, Severine, Clermidy, Fabien

المصدر: 2020 IEEE International Solid-State Circuits Conference - (ISSCC) Solid-State Circuits Conference - (ISSCC), 2020 IEEE International. :46-48 Feb, 2020

Relation: 2020 IEEE International Solid-State Circuits Conference - (ISSCC)

المؤلفون: MAILLIART, O., RENET, S., BERGER, F., GUEUGNOT, A., BISOTTO, S., GOUT, S., MATHIEU, L., GOIRAN, Y., CHAIRA, T.

المصدر: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) European Microelectronics and Packaging Conference & Exhibition (EMPC), 2019 22nd. :1-6 Sep, 2019

Relation: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)

المؤلفون: Coudrain, Perceval, Charbonnier, J., Garnier, A., Vivet, P., Velard, R., Vinci, A., Ponthenier, F., Farcy, A., Segaud, R., Chausse, P., Arnaud, L., Lattard, D., Guthmuller, E., Romano, G., Gueugnot, A., Berger, F., Beltritti, J., Mourier, T., Gottardi, M., Minoret, S., Ribiere, C., Romero, G., Philip, P.-E., Exbrayat, Y., Scevola, D., Campos, D., Argoud, M., Allouti, N., Eleouet, R., Fuguet Tortolero, C., Aumont, C., Dutoit, D., Legalland, C., Michailos, J., Cheramy, S., Simon, G.

المصدر: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :569-578 May, 2019

Relation: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

المؤلفون: Volpert, M., Henry, D., Taneja, D., Chaira, T., Gueugnot, A., Hodaj, F.

المصدر: 2018 7th Electronic System-Integration Technology Conference (ESTC) Electronic System-Integration Technology Conference (ESTC), 2018 7th. :1-7 Sep, 2018

Relation: 2018 7th Electronic System-Integration Technology Conference (ESTC)

المؤلفون: Chambion, B., Bouillard, B., Gasse, A., Vandeneynde, A., Ait-Mani, N., Gueugnot, A., Henry, D., Mercier, F., Rueda, P.

المصدر: 2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Thermal Investigations of ICs and Systems (THERMINIC), 2017 23rd International Workshop on. :1-5 Sep, 2017

Relation: 2017 23rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)