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1دورية أكاديمية
المؤلفون: A S M Raufur Chowdhury, Monjur Morshed Rabby, Mehzabeen Kabir, Partha Pratim Das, Rabin Bhandari, Rassel Raihan, Dereje Agonafer
المصدر: Materials, Vol 14, Iss 13, p 3565 (2021)
مصطلحات موضوعية: thermal gap filler material, dynamic mechanical analysis, thermomechanical analysis, differential scanning calorimetry, Fourier transform infrared spectroscopy, broadband dielectric spectroscopy, Technology, Electrical engineering. Electronics. Nuclear engineering, TK1-9971, Engineering (General). Civil engineering (General), TA1-2040, Microscopy, QH201-278.5, Descriptive and experimental mechanics, QC120-168.85
وصف الملف: electronic resource
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2
المؤلفون: Akshay Lakshminarayana, Milena Vujosevic, Dereje Agonafer, Abel Misrak, Tushar Chauhan, A S M Raufur Chowdhury, Rabin Bhandari, Fahad Mirza, B. Gholami Bazehhour
المصدر: Journal of Microelectronics and Electronic Packaging. 18:21-28
مصطلحات موضوعية: 010302 applied physics, Materials science, Computer Networks and Communications, Nanotechnology, 02 engineering and technology, Mems sensors, 021001 nanoscience & nanotechnology, 01 natural sciences, Die (integrated circuit), Electronic, Optical and Magnetic Materials, 0103 physical sciences, Sample preparation, Electrical and Electronic Engineering, 0210 nano-technology
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::b489f8d69d64b5841520cf64271ee8af
https://doi.org/10.4071/imaps.1234982 -
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المؤلفون: Krishna Bhavana Sivaraju, A S M Raufur Chowdhury, Dereje Agonafer, Tushar Chauhan, Rabin Bhandari
المصدر: Journal of Enhanced Heat Transfer. 28:73-90
مصطلحات موضوعية: Fluid Flow and Transfer Processes, Printed circuit board, Materials science, Mechanical Engineering, Immersion (virtual reality), Composite material, Condensed Matter Physics
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::fb8d8d7e8959a734c844919fbf064744
https://doi.org/10.1615/jenhheattransf.2021039486 -
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المؤلفون: Akshay Lakshminarayana, A S M Raufur Chowdhury, Dereje Agonafer, Abel Misrak, Tushar Chauhan, Rabin Bhandari
المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: Materials science, Reliability (semiconductor), JEDEC memory standards, Power cycling, Mechanical engineering, Temperature cycling, Dynamic mechanical analysis, Drop test, Viscoelasticity, Drop impact
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::66f0f155f952dc959eec788ef4b3a34e
https://doi.org/10.1109/ectc32862.2020.00353 -
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المؤلفون: Rabin Bhandari, Partha Pratim Das, Dereje Agonafer, Monjur Morshed Rabby, Rassel Raihan, A S M Raufur Chowdhury, Mehzabeen Kabir
المصدر: Materials
Materials, Vol 14, Iss 3565, p 3565 (2021)
Volume 14
Issue 13مصطلحات موضوعية: Technology, Materials science, Dielectric, Article, Viscoelasticity, chemistry.chemical_compound, Thermal conductivity, Silicone, Differential scanning calorimetry, General Materials Science, Composite material, dynamic mechanical analysis, thermomechanical analysis, Microscopy, QC120-168.85, thermal gap filler material, QH201-278.5, Fourier transform infrared spectroscopy, Dynamic mechanical analysis, Engineering (General). Civil engineering (General), broadband dielectric spectroscopy, TK1-9971, Characterization (materials science), Descriptive and experimental mechanics, chemistry, Thermomechanical analysis, Electrical engineering. Electronics. Nuclear engineering, TA1-2040, differential scanning calorimetry
وصف الملف: application/pdf