المؤلفون: Abadie, V, Bohorquez, D, Bulstrode, NW, Davies, G, Hakelius, M, Ong, J, Mathijssen, IMJ, Matos, E, Mazzoleni, F, van der Molen, AM, Muradin, M, Neovius, E, Piacentile, K, Redondo, M, Vuola, P, Wolvius, EB, Reinert, S, Murray, D, Peterson, P, Hens, G, Schachner, P, Sivertsen, A, Irvine, WFE, Welling-van Overveld, LFJ, van Breugel, M, van Schalkwijk, K, Verhey, E, Khan, A, Baillie, L, Bishop, N, Hillyar, CRT, Koudstaal, MJ, van de Lande, L, Nibber, A, Panciewicz, N, Ramjeeawan, A, Bouter, A, El Ghoul, K, Logjes, B, van der Plas, P, Kats, J, Weissbach, E, van Veen-van der Hoek, M, Bittermann, AJN, van den Boogaard, MJH, Coenraad, S, Dulfer, K, Joosten, K, Lachmeijer, AMA, Muradin, MSM, Peters, NCJ, Pleumeekers, M, de Veye, HS

المصدر: The Journal of craniofacial surgery. 35(1):279-361

مصطلحات موضوعية: Medicin och hälsovetenskap

URL الوصول: http://kipublications.ki.se/Default.aspx?queryparsed=id:154765839

المؤلفون: Elsinger, G., Oprins, H., Cherman, V., Van der Plas, G., Beyne, E., De Wolf, I.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 14(7):1180-1188 Jul, 2024

المؤلفون: Pantano, Nicolas, Stucchi, Michele, Van der Plas, Geert, Beyne, Eric

المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1064-1071 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

المؤلفون: Lofrano, Melina, Oprins, Herman, Cherman, Vladimir, Witters, Lisbeth, Jourdain, Anne, Van der Plas, Geert, Beyne, Eric

المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1036-1043 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

المؤلفون: Park, Jae-Woo, Pantano, Nicolas, Van Der Plas, Geert, Beyne, Eric, Chun, Jung-Hoon

المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1072-1077 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

المؤلفون: van Vuren, RMG, Janssen, YF, Hogenbirk, RNM, de Graaff, MR, van den Hoek, R, Kruijff, S, Heineman, DJ, van der Plas, WY, Wouters, MWJM

المصدر: Cancers. 16(9)

مصطلحات موضوعية: Medicin och hälsovetenskap

URL الوصول: http://kipublications.ki.se/Default.aspx?queryparsed=id:158216075

المؤلفون: Simicic, Marko, Gijbels, Frank, Iacovo, Serena, Chen, Shih-Hung, Van Der Plas, Geert, Beyne, Eric

المصدر: 2023 45th Annual EOS/ESD Symposium (EOS/ESD) EOS/ESD Symposium (EOS/ESD), 2023 45th Annual. EOS-45:1-7 Oct, 2023

Relation: 2023 45th Annual EOS/ESD Symposium (EOS/ESD)

المؤلفون: Lin, Shih-Hsiang, Simicic, Marko, Pantano, Nicolas, Chen, Shih-Hung, Roussel, Philippe, Van Der Plas, Geert, Beyne, Eric, Wambacq, Piet

المصدر: 2023 45th Annual EOS/ESD Symposium (EOS/ESD) EOS/ESD Symposium (EOS/ESD), 2023 45th Annual. EOS-45:1-9 Oct, 2023

Relation: 2023 45th Annual EOS/ESD Symposium (EOS/ESD)

المؤلفون: Jung, Vincent, van der Plas, Lonneke

مصطلحات موضوعية: Computer Science - Computation and Language

URL الوصول: http://arxiv.org/abs/2402.13016

المؤلفون: Bosman, D., Huynen, M., De Zutter, D., Sun, X., Pantano, N., Van der Plas, G., Beyne, E., Ginste, D.V.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 13(10):1567-1575 Oct, 2023