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1دورية أكاديمية
المؤلفون: Balas, R., Ottaviano, A., Benini, L.
المصدر: IEEE Transactions on Very Large Scale Integration (VLSI) Systems IEEE Trans. VLSI Syst. Very Large Scale Integration (VLSI) Systems, IEEE Transactions on. 32(6):1032-1044 Jun, 2024
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2مؤتمر
المؤلفون: Benz, Thomas, Ottaviano, Alessandro, Balas, Robert, Garofalo, Angelo, Restuccia, Francesco, Biondi, Alessandro, Benini, Luca
المصدر: 2024 Design, Automation & Test in Europe Conference & Exhibition (DATE) Design, Automation & Test in Europe Conference & Exhibition (DATE), 2024. :1-6 Mar, 2024
Relation: 2024 Design, Automation & Test in Europe Conference & Exhibition (DATE)
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3مؤتمر
المصدر: 2024 Design, Automation & Test in Europe Conference & Exhibition (DATE) Design, Automation & Test in Europe Conference & Exhibition (DATE), 2024. :1-6 Mar, 2024
Relation: 2024 Design, Automation & Test in Europe Conference & Exhibition (DATE)
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4دورية أكاديمية
المؤلفون: Michael Balas, Rachelle M. Scheepers, Zsolt Zador, George M. Ibrahim, Laila Premji, Christopher D. Witiw
المصدر: Advances in Health Sciences Education. 2024 29(3):829-840.
Peer Reviewed: Y
Page Count: 12
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5تقرير
المؤلفون: Rogenmoser, Michael, Ottaviano, Alessandro, Benz, Thomas, Balas, Robert, Perotti, Matteo, Garofalo, Angelo, Benini, Luca
مصطلحات موضوعية: Computer Science - Hardware Architecture
URL الوصول: http://arxiv.org/abs/2406.06546
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6مؤتمر
المؤلفون: Rotar, Raul, Vartaci, Naomi, Balas, Marius, Opritoiu, Flavius, Vladutiu, Mircea
المصدر: 2023 IEEE 29th International Symposium for Design and Technology in Electronic Packaging (SIITME) Design and Technology in Electronic Packaging (SIITME), 2023 IEEE 29th International Symposium for. :28-33 Oct, 2023
Relation: 2023 IEEE 29th International Symposium for Design and Technology in Electronic Packaging (SIITME)
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7مؤتمر
المؤلفون: Pochwatko, Grzegorz, Kopec, Wieslaw, Swidrak, Justyna, Jaskulska, Anna, Skorupska, Kinga H., Karpowicz, Barbara, Maslyk, Rafal, Grzeszczuk, Maciej, Barnes, Steven, Borkiewicz, Paulina, Kobylinski, Pawel, Pabis-Orzeszyna, Michal, Balas, Robert, Lazarek, Jagoda, Dufresne, Florian, Bensch, Leonie, Nilsson, Tommy
المصدر: 2023 IEEE International Symposium on Mixed and Augmented Reality (ISMAR) ISMAR Mixed and Augmented Reality (ISMAR), 2023 IEEE International Symposium on. :185-194 Oct, 2023
Relation: 2023 IEEE International Symposium on Mixed and Augmented Reality (ISMAR)
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8دورية أكاديمية
المؤلفون: A. Pérez-Martínez, M. Mora-Rillo, C. Ferreras, P. Guerra-García, B. Pascual-Miguel, C. Mestre-Durán, A.M. Borobia, A.J. Carcas, J. Queiruga-Parada, I. García, E. Sánchez-Zapardiel, M. Gasior, R. De Paz, A. Marcos, J.L. Vicario, A. Balas, M.A. Moreno, C. Eguizabal, C. Solano, J.R. Arribas, R.de Miguel Buckley, R. Montejano, B. Soria
المصدر: EClinicalMedicine, Vol 39, Iss , Pp 101086- (2021)
مصطلحات موضوعية: Medicine (General), R5-920
وصف الملف: electronic resource
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9مؤتمر
المؤلفون: Popa, Mihaela, Balas, Valentina E.
المصدر: 2023 Asia Conference on Power, Energy Engineering and Computer Technology (PEECT) PEECT Power, Energy Engineering and Computer Technology (PEECT), 2023 Asia Conference on. :32-36 Jul, 2023
Relation: 2023 Asia Conference on Power, Energy Engineering and Computer Technology (PEECT)
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10مؤتمر
المؤلفون: Cuomo, Luca, Scordino, Claudio, Ottaviano, Alessandro, Wistoff, Nils, Balas, Robert, Benini, Luca, Guidieri, Errico, Savino, Ida Maria
المصدر: 2023 12th Mediterranean Conference on Embedded Computing (MECO) Embedded Computing (MECO), 2023 12th Mediterranean Conference on. :1-8 Jun, 2023
Relation: 2023 12th Mediterranean Conference on Embedded Computing (MECO)