يعرض 1 - 10 نتائج من 380,781 نتيجة بحث عن '"A. Chong"', وقت الاستعلام: 1.56s تنقيح النتائج
  1. 1
    مؤتمر
    Process Challenges in Thin Wafers Fabrication with Double Side Hybrid Bond Pads for Chip Stacking

    المؤلفون: Kumar, Mishra Dileep, Nagendra Sekhar, Vasarla, Rao, B.S.S. Chandra, Choong Chong, Ser, Rao, Vempati Srinivasa

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :614-619 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  2. 2
    مؤتمر
    Dielectric Stack Optimization for Die-level Warpage Reduction for Chip-to-Wafer Hybrid Bonding

    المؤلفون: Rao, B.S.S. Chandra, Kumar, Mishra Dileep, Sekhar, Vasarla Nagendra, Daniel, Ismael Cereno, Tippabhotla, Sasi Kumar, Chong, Ser Choong, C, Hemanth Kumar, Rao, Vempati Srinivasa

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :62-68 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  3. 3
    مؤتمر
    A Compact Wafer-Level Heterogeneously Integrated Scalable Optical Transceiver for Data Centers

    المؤلفون: Nair Gourikutty, Sajay Bhuvanendran, Wu, Jiaqi, Lim, Teck Guan, Sandra, San, Jong, Ming Chinq, Lai Yee, Chia, Long, Lau Boon, Soon Wee Ho, David, Choong, Chong Ser, Liang, Ding, Tu, Xiaoguang, Wang, Wanjun, Tan, Chee-Keong, See, Alison, Wang, Hsiu-Che, Coccioli, Roberto, Tan, Ronson, Nagarajan, Radhakrishnan, Bhattacharya, Surya

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1398-1403 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  4. 4
    مؤتمر
    Vertical Stacking of Heterogeneous Chiplets of Duplexer on LNA/SOI

    المؤلفون: Chong, Chai Tai, Rotaru, Mihai, Xiangyu, Wang, Pei Siang, Sharon Lim, Lin, Ji, Mandal, Rathin, Mani, Raju, Chinq, Jong Ming, Yong Liang, Ye

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :2017-2023 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  5. 5
    مؤتمر
    Multi-Chip Stacked Memory Module Development using Chip to Wafer (C2W) Hybrid Bonding for Heterogeneous Integration Applications

    المؤلفون: Sekhar, Vasarla Nagendra, Kumar, Mishra Dileep, Tippabhotla, Sasi Kumar, Rao, B. S. S. Chandra, Daniel, Ismael Cereno, Chong, Ser Choong, Rao, Vempati Srinivasa

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :2024-2030 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  6. 6
    مؤتمر
    Quantum Readout Processing Accelerator with a CORDIC Core at Cryogenic Temperature

    المؤلفون: Chong, Yi Sheng, Cao, Hongyu, Goh, Wang Ling, Bore, Patrick, Tan, Yuanzheng Paul, Szen Yap, Yung, Dumke, Rainer, Nambiar, Vishnu P., Tuan Do, Anh

    المصدر: 2024 IEEE International Symposium on Circuits and Systems (ISCAS) Circuits and Systems (ISCAS), 2024 IEEE International Symposium on. :1-5 May, 2024

    Relation: 2024 IEEE International Symposium on Circuits and Systems (ISCAS)

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  7. 7
    مؤتمر
    3881 Gbps/W, 3005 µm AES Core with State Based Clock Gating for IoT applications

    المؤلفون: Pei, Zhangyi, Nambiar, Vishnu P., Sheng Chong, Yi, Goh, Wang Ling, Tuan Do, Anh

    المصدر: 2024 IEEE International Symposium on Circuits and Systems (ISCAS) Circuits and Systems (ISCAS), 2024 IEEE International Symposium on. :1-5 May, 2024

    Relation: 2024 IEEE International Symposium on Circuits and Systems (ISCAS)

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  8. 8
    مؤتمر
    A Novel Non-profiling Side-Channel Attack on Masked Devices with Connectivity Matrix

    المؤلفون: Chen, Juncheng, Zhang, Han, Yang, Zishuo, Xu, Yicheng, Kyaw, Nay Aung, Chong, Kwen-Siong, Lin, Zhiping, Gwee, Bah-Hwee

    المصدر: 2024 IEEE International Symposium on Circuits and Systems (ISCAS) Circuits and Systems (ISCAS), 2024 IEEE International Symposium on. :1-5 May, 2024

    Relation: 2024 IEEE International Symposium on Circuits and Systems (ISCAS)

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  9. 9
    مؤتمر
    A 420 GOPS/W CGRA with a Configurable MAC and Dynamic Truncation

    المؤلفون: Chong, Yi Sheng, Harish, Rakshith, Panicker, Rajesh Chandrasekhara, Nambiar, Vishnu P., Do, Anh Tuan

    المصدر: 2024 IEEE International Symposium on Circuits and Systems (ISCAS) Circuits and Systems (ISCAS), 2024 IEEE International Symposium on. :1-5 May, 2024

    Relation: 2024 IEEE International Symposium on Circuits and Systems (ISCAS)

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  10. 10
    مؤتمر
    Adaptive Torque Ripple Suppression Strategy for Switched Reluctance Machine Based on Fuzzy Iterative Learning Control

    المؤلفون: Yang, Qingkun, Song, Shoujun, Yang, Chenyi, Sui, Yu, Cheng, Qiyuan, Bao, Chong

    المصدر: 2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia) Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia), 2024 IEEE 10th International. :457-461 May, 2024

    Relation: 2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia)

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