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1دورية أكاديمية
المؤلفون: Zhao, W., Wasala, S., Persoons, T.
المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 13(8):1139-1146 Aug, 2023
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2دورية أكاديميةGuest Editorial Special Section on Advances in Modeling and Characterization for Electronics Cooling
المؤلفون: Persoons, T., Codecasa, L.
المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 13(8):1085-1087 Aug, 2023
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3مؤتمر
المؤلفون: Wasala, Sahan, Stevens, Lon, Sosseh, Raye, Persoons, Tim
المصدر: 2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Thermal Investigations of ICs and Systems (THERMINIC), 2022 28th International Workshop on. :1-4 Sep, 2022
Relation: 2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
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4مؤتمر
المؤلفون: Abdelsalam, Younis Osama, Persoons, Tim, Alimohammadi, Sajad
المصدر: 2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Thermal Investigations of ICs and Systems (THERMINIC), 2022 28th International Workshop on. :1-4 Sep, 2022
Relation: 2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
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5مؤتمر
المؤلفون: Zhao, Wenguang, Wasala, Sahan, Persoons, Tim
المصدر: 2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Thermal Investigations of ICs and Systems (THERMINIC), 2022 28th International Workshop on. :1-4 Sep, 2022
Relation: 2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
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6مؤتمر
المؤلفون: Oude Essink, Eoin H., Persoons, Tim, Alimohammadi, Sajad
المصدر: 2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) Thermal Investigations of ICs and Systems (THERMINIC), 2022 28th International Workshop on. :1-6 Sep, 2022
Relation: 2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
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7مؤتمر
المصدر: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2022 21st IEEE Intersociety Conference on. :1-6 May, 2022
Relation: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
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8تقرير
المؤلفون: Persoons, Robin, Sensi, Mattia, Prasse, Bastian, Van Mieghem, Piet
المصدر: Physical Review E (2024)
مصطلحات موضوعية: Mathematics - Dynamical Systems, Quantitative Biology - Populations and Evolution, 92D30, 92D25, 34A34
URL الوصول: http://arxiv.org/abs/2305.12446
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9دورية أكاديميةNovel iminocoumarin imidazo[4,5-b]pyridine derivatives: design, synthesis, and biological evaluation
المؤلفون: Pavlinac, Ida Boček, Starčević, Kristina, Persoons, Leentje, Banjanac, Mihailo, Radovanović, Vedrana, Daelemans, Dirk, Hranjec, MarijanaAff1, IDs10593024032961_cor7
المصدر: Chemistry of Heterocyclic Compounds. 60(1-2):75-82
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10دورية أكاديمية
المؤلفون: Battaglioli, S., James, O., Gibbons, M.J., Persoons, T.
المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 11(11):1750-1758 Nov, 2021
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