يعرض 1 - 10 نتائج من 8,140 نتيجة بحث عن '"A. Sardi"', وقت الاستعلام: 1.31s تنقيح النتائج
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    مؤتمر

    المصدر: 2024 2nd International Conference on Software Engineering and Information Technology (ICoSEIT) Software Engineering and Information Technology (ICoSEIT), 2024 2nd International Conference on. :293-298 Feb, 2024

    Relation: 2024 2nd International Conference on Software Engineering and Information Technology (ICoSEIT)

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    مؤتمر

    المصدر: 2023 International Conference on Advanced Mechatronics, Intelligent Manufacture and Industrial Automation (ICAMIMIA) Advanced Mechatronics, Intelligent Manufacture and Industrial Automation (ICAMIMIA), 2023 International Conference on. :1-5 Nov, 2023

    Relation: 2023 International Conference on Advanced Mechatronics, Intelligent Manufacture and Industrial Automation (ICAMIMIA)

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    مؤتمر

    المصدر: 2023 9th International Conference on Education and Technology (ICET) Education and Technology (ICET), 2023 9th International Conference on. :36-41 Oct, 2023

    Relation: 2023 9th International Conference on Education and Technology (ICET)

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    دورية أكاديمية

    المؤلفون: Oktaviana, Adhi AgusAff1, Aff2, Aff3, Aff4, Joannes-Boyau, Renaud, Hakim, BudiantoAff6, Aff7, Burhan, Basran, Sardi, RatnoAff6, Aff7, Adhityatama, ShinatriaAff1, Aff3, Hamrullah, Sumantri, IwanAff7, Aff10, Tang, M., Lebe, RustanAff7, Aff12, Ilyas, Imran, Abbas, Abdullah, Jusdi, AndiAff7, Aff11, Mahardian, Dewangga EkaAff2, Aff4, Noerwidi, SofwanAff2, Aff4, Aff7, Ririmasse, Marlon N. R.Aff7, Aff13, Mahmud, IrfanAff6, Aff7, Duli, AkinAff7, Aff10, Aksa, Laode M., McGahan, David, Setiawan, Pindi, Brumm, AdamAff8, Aff15, Aubert, MaximeAff1, Aff3, Aff5, Aff8, IDs41586024075417_cor23

    المصدر: Nature: International weekly journal of science. 631(8022):814-818

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    مؤتمر

    المصدر: 2023 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP) Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP), 2023 Symposium on. :1-4 May, 2023

    Relation: 2023 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP)

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