المؤلفون: Seiler, K.M., Kong, F.H., Fitch, R.

المصدر: IEEE Robotics and Automation Letters IEEE Robot. Autom. Lett. Robotics and Automation Letters, IEEE. 9(9):7715-7722 Sep, 2024

المؤلفون: Gomory, F., Solovyov, M., Souc, J., Frolek, L., Kujovic, T., Seiler, E., Ries, R., Mosat, M., Winkler, T., Sugita, K., Dhalle, M., Krooshoop, H.J.G., Hintze, C., Troshyn, A., Prusseit, W., Nedergaard, L., Traberg, L., Christensen, J.J., Jorgensen, N.O., Bahl, C.R.H., Wulff, A.C.

المصدر: IEEE Transactions on Applied Superconductivity IEEE Trans. Appl. Supercond. Applied Superconductivity, IEEE Transactions on. 34(5):1-5 Aug, 2024

المؤلفون: Brand, F., Seiler, J., Kaup, A.

المصدر: IEEE Transactions on Circuits and Systems for Video Technology IEEE Trans. Circuits Syst. Video Technol. Circuits and Systems for Video Technology, IEEE Transactions on. 34(7):6445-6459 Jul, 2024

المؤلفون: Latsch, Bastian, Ben Dali, Omar, Hench, Benedikt, Chadda, Romol, Sellami, Youssef, Altmann, Alexander A., Schafer, Niklas, Seiler, Julian, Kupnik, Mario

المصدر: 2024 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS) Flexible and Printable Sensors and Systems (FLEPS), 2024 IEEE International Conference on. :1-4 Jun, 2024

Relation: 2024 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)

المؤلفون: Brand, Fabian, Seiler, Jurgen, Sauer, Johannes, Alshina, Elena, Kaup, Andre

المصدر: 2024 Picture Coding Symposium (PCS) Picture Coding Symposium (PCS), 2024. :1-5 Jun, 2024

Relation: 2024 Picture Coding Symposium (PCS)

المؤلفون: Sippel, Frank, Genser, Nils, Och, Hannah, Seiler, Jurgen, Kaup, Andre

المصدر: ICASSP 2024 - 2024 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP) Acoustics, Speech and Signal Processing (ICASSP), ICASSP 2024 - 2024 IEEE International Conference on. :3575-3579 Apr, 2024

Relation: ICASSP 2024 - 2024 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP)

المؤلفون: Sippel, Frank, Seiler, Jurgen, Kaup, Andre

المصدر: ICASSP 2024 - 2024 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP) Acoustics, Speech and Signal Processing (ICASSP), ICASSP 2024 - 2024 IEEE International Conference on. :3265-3269 Apr, 2024

Relation: ICASSP 2024 - 2024 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP)

المؤلفون: Maus, I., Niessner, M., Zhang, M., Hartner, W., Seiler, B., Altieri-Weimar, P.

المصدر: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-6 Apr, 2024

Relation: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

المؤلفون: Seiler, Anna M., Statz, Martin, Eckel, Christian, Weimer, Isabell, Pöhls, Jonas, Watanabe, Kenji, Taniguchi, Takashi, Zhang, Fan, Weitz, R. Thomas

مصطلحات موضوعية: Condensed Matter - Mesoscale and Nanoscale Physics, Condensed Matter - Strongly Correlated Electrons

URL الوصول: http://arxiv.org/abs/2408.16628

المؤلفون: Sippel, Frank, Seiler, Jürgen, Kaup, André

مصطلحات موضوعية: Electrical Engineering and Systems Science - Image and Video Processing

URL الوصول: http://arxiv.org/abs/2408.14050