المؤلفون: Y.S. Chiu, C.R. Kao, A. Shigetou

المصدر: Materials & Design, Vol 195, Iss , Pp 109065- (2020)

مصطلحات موضوعية: Bonding, Low temperature solder, Surface analysis, 3D packaging, Materials of engineering and construction. Mechanics of materials, TA401-492

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S0264127520306006; https://doaj.org/toc/0264-1275

URL الوصول: https://doaj.org/article/5cccb7df2fb94b5c8a9f2a9306abeeb2

المؤلفون: Suzuki, Takumi, Kitazawa, Yugo, Motohashi, Tomohiro Neil, Koinuma, Hiroaki, Kimura, Kan, Nishikawa, Minaho, Maejima, Kensaku, Ichikawa, Kazunori, Namba, Shigetou, Yamaji, Yasuyuki^{Aff1, IDs1032702301149x_cor10}

المصدر: Journal of General Plant Pathology. 89(6):347-351

المؤلفون: Mako Akahori, Akio Miyazaki, Hiroaki Koinuma, Ryosuke Tokuda, Nozomu Iwabuchi, Yugo Kitazawa, Kensaku Maejima, Shigetou Namba, Yasuyuki Yamaji

المصدر: Microbiology Spectrum, Vol 12, Iss 5 (2024)

مصطلحات موضوعية: CTAB, FTA card, on-site detection, ribosomal RNA operon, simple DNA extraction, insect vector, Microbiology, QR1-502

وصف الملف: electronic resource

Relation: https://doaj.org/toc/2165-0497

URL الوصول: https://doaj.org/article/bdc1686db5594dffaa4cc2b703555e73

المؤلفون: Suzuki, Takumi, Kitazawa, Yugo, Motohashi, Tomohiro Neil, Koinuma, Hiroaki, Kimura, Kan, Nishikawa, Minaho, Maejima, Kensaku, Ichikawa, Kazunori, Namba, Shigetou, Yamaji, Yasuyuki^{Aff1, IDs1032702301164y_cor10}

المصدر: Journal of General Plant Pathology. 90(2):124-124

المؤلفون: Hainey, M., Mano, T., Kasaya, T., Jimba, Y., Miyazaki, H., Ochiai, T., Osato, H., Watanabe, K., Sugimoto, Y., Kawazu, T., Arai, Y., Shigetou, A., Miyazaki, H.T.

المصدر: 2020 Fourteenth International Congress on Artificial Materials for Novel Wave Phenomena (Metamaterials) Artificial Materials for Novel Wave Phenomena (Metamaterials), 2020 Fourteenth International Congress on. :219-221 Sep, 2020

Relation: 2020 Fourteenth International Congress on Artificial Materials for Novel Wave Phenomena (Metamaterials)

المؤلفون: Shigetou, Akitsu, Yang, Tilo H., Kao, C. Robert

المصدر: 2019 International 3D Systems Integration Conference (3DIC) 3D Systems Integration Conference (3DIC), 2019 International. :1-3 Oct, 2019

Relation: 2019 International 3D Systems Integration Conference (3DIC)

المؤلفون: Yang, Tilo H., Chiu, Yu-Shan, Yu, Hai-Yang, Shigetou, Akitsu, Kao, C. Robert

المصدر: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :235-242 May, 2019

Relation: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

المؤلفون: Yang, T. H., Yang, C. Y., Shigetou, A., Kao, C. R.

المصدر: 2019 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2019 International Conference on. :117-122 Apr, 2019

Relation: 2019 International Conference on Electronics Packaging (ICEP)

المؤلفون: Yang, Tilo Hongwei, Kao, C. Robert, Shigetou, Akitsu

المصدر: 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), 2018 International Conference on. :438-442 Apr, 2018

Relation: 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)

المؤلفون: Fu, Weixin, Shigetou, Akitsu, Shoji, Shuichi, Mizuno, Jun

المصدر: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th. :2541-2546 May, 2016

Relation: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC)