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1دورية أكاديمية
المؤلفون: Watts, EL, Gonzales, TI, Strain, T, Saint-Maurice, PF, Bishop, DT, Chanock, SJ, Johansson, M, Keku, TO, Le Marchand, L, Moreno, V, Newcomb, PA, Newton, CC, Pai, RK, Purdue, MP, Ulrich, CM, Smith-Byrne, K, Van Guelpen, B, Day, FR, Wijndaele, K, Wareham, NJ, Matthews, CE, Moore, SC, Brage, S, Eeles, RA, Haiman, CA, Kote-Jarai, Z, Schumacher, FR, Benlloch, S, Al Olama, AA, Muir, KR, Berndt, SI, Conti, DV, Wiklund, F, Wang, Y, Tangen, CM, Batra, J, Clements, JA, Gronberg, H, Pashayan, N, Schleutker, J, Albanes, D, Weinstein, SJ, Wolk, A, West, CML, Mucci, LA, Cancel-Tassin, G, Koutros, S, Sorensen, KD, Grindedal, EM, Neal, DE, Hamdy, FC, Donovan, JL, Travis, RC, Hamilton, RJ, Ingles, SA, Rosenstein, BS, Lu, YJ, Giles, GG, MacInnis, RJ, Kibel, AS, Vega, A, Kogevinas, M, Penney, KL, Park, JY, Stanford, JL, Cybulski, C, Nordestgaard, BG, Nielsen, SF, Brenner, H, Maier, C, Kim, J, John, EM, Teixeira, MR, Neuhausen, SL, De Ruyck, K, Razack, A, Newcomb, LF, Lessel, D, Kaneva, R, Usmani, N, Claessens, F, Townsend, PA, Castelao, JE, Roobol, MJ, Menegaux, F, Khaw, KT, Cannon-Albright, L, Pandha, H, Thibodeau, SN, Hunter, DJ, Kraft, P, Blot, WJ, Riboli, E
المصدر: British journal of cancer. 130(1):114-124
مصطلحات موضوعية: Medicin och hälsovetenskap
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2مؤتمر
المؤلفون: Janota, Jiri, Blaha, Jan, Rekabi-Bana, Fatemeh, Ulrich, Jiri, Stefanec, Martin, Fedotoff, Laurenz, Arvin, Farshad, Schmickl, Thomas, Krajnik, Tomas
المصدر: 2024 International Conference on Manipulation, Automation and Robotics at Small Scales (MARSS) Manipulation, Automation and Robotics at Small Scales (MARSS), 2024 International Conference on. :1-6 Jul, 2024
Relation: 2024 International Conference on Manipulation, Automation and Robotics at Small Scales (MARSS)
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3مؤتمر
المؤلفون: Liu, Shiqing, Ruckert, Ulrich, Jin, Yaochu
المصدر: 2024 IEEE Congress on Evolutionary Computation (CEC) Evolutionary Computation (CEC), 2024 IEEE Congress on. :1-8 Jun, 2024
Relation: 2024 IEEE Congress on Evolutionary Computation (CEC)
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4مؤتمر
المؤلفون: Wang, Xiangyu, Wang, Xilu, Jin, Yaochu, Ruckert, Ulrich
المصدر: 2024 IEEE Congress on Evolutionary Computation (CEC) Evolutionary Computation (CEC), 2024 IEEE Congress on. :1-8 Jun, 2024
Relation: 2024 IEEE Congress on Evolutionary Computation (CEC)
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5مؤتمر
المؤلفون: Sittkus, Benjamin, Petit, Julien, Urban, Gerald, Mescheder, Ulrich
المصدر: 2024 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS) Flexible and Printable Sensors and Systems (FLEPS), 2024 IEEE International Conference on. :1-4 Jun, 2024
Relation: 2024 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)
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6مؤتمرInvestigation of solution processable moisture barrier films based on a polymer and filler materials
المؤلفون: Chen, Zehua, Gengenbach, Ulrich, Gananian, Shant, Moser, Daniel, Reichert, Klaus-Martin, Koker, Liane
المصدر: 2024 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS) Flexible and Printable Sensors and Systems (FLEPS), 2024 IEEE International Conference on. :1-4 Jun, 2024
Relation: 2024 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)
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7مؤتمر
المؤلفون: Mengue, Prince, Meistersheim, Laurine, Youbi, Ulrich, Hage-Ali, Sami, Floer, Cecile, Petit-Watelot, Sebastien, Zhgoon, Sergei, Hehn, Michel, Elmazria, Omar
المصدر: 2024 IEEE International Conference on RFID (RFID) RFID (RFID), 2024 IEEE International Conference on. :1-5 Jun, 2024
Relation: 2024 IEEE International Conference on RFID (RFID)
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8مؤتمر
المؤلفون: MD Ashif, Nowab Reza, Gengenbach, Ulrich, Sieber, Ingo
المصدر: 2024 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2024 Symposium on. :1-5 Jun, 2024
Relation: 2024 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)
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9مؤتمر
المؤلفون: Koker, Liane, Reichert, Klaus-Martin, Gengenbach, Ulrich, Reischl, Markus, Ungerer, Martin
المصدر: 2024 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2024 Symposium on. :1-6 Jun, 2024
Relation: 2024 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)
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10مؤتمر
المصدر: 2024 IEEE Intelligent Vehicles Symposium (IV) Intelligent Vehicles Symposium (IV), 2024 IEEE. :857-864 Jun, 2024
Relation: 2024 IEEE Intelligent Vehicle Symposium (IV)