المؤلفون: Kang, T., Lee, S., Song, S., Haghighat, M.R., Flynn, M.P.

المصدر: IEEE Journal of Solid-State Circuits IEEE J. Solid-State Circuits Solid-State Circuits, IEEE Journal of. 59(6):1794-1808 Jun, 2024

المؤلفون: Otsu, Toshio, Tani, Shuntaro, Nagayama, Shoko, Miyamoto, Ryo, Okada, George, Nakamura, Naoyuki, Nishimae, Junichi, Tamaru, Hroharu, Kobayashi, Yohei

المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :829-833 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

المؤلفون: Harish, Vineeth, Sahoo, Krutikesh, Zheng, Kai, Park, Gilbert, Chen, Han-Wen, Verhaverbeke, Steven, Iyer, Subramanian S.

المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :2178-2183 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

المؤلفون: Kang, Byoung-Phil, Lee, Ken, Kim, Jaesung, Lee, Jong-Yun

المصدر: 2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) Electron Devices Technology & Manufacturing Conference (EDTM), 2024 8th IEEE. :1-3 Mar, 2024

Relation: 2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)

المؤلفون: Pradeep, K, Praveen, K, Pavithra, S, Kaaviya, G

المصدر: 2023 International Conference on Data Science, Agents & Artificial Intelligence (ICDSAAI) Data Science, Agents & Artificial Intelligence (ICDSAAI), 2023 International Conference on. :1-5 Dec, 2023

Relation: 2023 International Conference on Data Science, Agents & Artificial Intelligence (ICDSAAI)

المؤلفون: Guo, Zhi-Hua, Liu, Hong, Zheng, Si-Qi, Wang, Xue-Ping, Xie, Zhi-Hua, Zhang, Zheng-Mao, Liu, Jing-Rong, Li, Ji-Mei, Lin, Shao-Yan, Gu, Chao^{Aff1, IDs10725024011826_cor10}, Zhang, Shao-Ling^{Aff1, IDs10725024011826_cor11}

المصدر: Plant Growth Regulation: An International Journal on Plant Growth and Development. :1-13

المؤلفون: Lin, Rosa, Yip, Laurene, Lai, Charles, Lin, Bing-Yeh, Peng, Cooper, Syu, Chris, Chang, Melanie

المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :277-282 May, 2023

Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

المؤلفون: S, Berlin Shaheema, Muppalaneni, Naresh Babu, J, Jasper

المصدر: 2022 IEEE Silchar Subsection Conference (SILCON) Silchar Subsection Conference (SILCON), 2022 IEEE. :1-7 Nov, 2022

Relation: 2022 IEEE Silchar Subsection Conference (SILCON)

المؤلفون: Chen, Qiansi^{Aff1, IDs11105023014127_cor1}, Liu, Pingping, Li, Zefeng, Zheng, Qingxia, Zhou, Huina, Liu, Jinyan, Cao, Peijian, Fang, Ming^{Aff2, IDs11105023014127_cor8}

المصدر: Plant Molecular Biology Reporter. 42(1):151-164

المؤلفون: Li, Chong, Wang, Hao, Shen, Hongtao, Li, Qian, Tao, Peng, Li, Bing, Wang, Yongda

المصدر: 2022 IEEE 10th Joint International Information Technology and Artificial Intelligence Conference (ITAIC) Information Technology and Artificial Intelligence Conference (ITAIC), 2022 IEEE 10th Joint International. 10:1224-1232 Jun, 2022

Relation: 2022 IEEE 10th Joint International Information Technology and Artificial Intelligence Conference (ITAIC)