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1دورية أكاديمية
المؤلفون: Tang, W., Cho, S., Hoang, T.T., Botimer, J., Zhu, W.Q., Chang, C., Lu, C., Zhu, J., Tao, Y., Wei, T., Motwani, N.K., Yalamanchi, M., Yarlagadda, R., Kale, S.R., Flanigan, M., Chan, A., Tran, T., Shumarayev, S., Zhang, Z.
المصدر: IEEE Journal of Solid-State Circuits IEEE J. Solid-State Circuits Solid-State Circuits, IEEE Journal of. 59(4):1235-1245 Apr, 2024
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2دورية أكاديمية
المؤلفون: Ola, AnneAff1, IDs11104024064904_cor1, Dodd, Ian C., Albacete, Alfonso, Xiong, YanmeiAff1, Aff4, Rasmussen, Amanda, De Diego, Nuria, Lovelock, Catherine E.
المصدر: Plant and Soil: An International Journal on Plant-Soil Relationships. 500(1-2):417-430
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3مؤتمر
المصدر: 2023 IEEE International 3D Systems Integration Conference (3DIC) 3D Systems Integration Conference (3DIC), 2023 IEEE International. :1-5 May, 2023
Relation: 2023 IEEE International 3D Systems Integration Conference (3DIC)
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4مؤتمر
المؤلفون: Kudo, Hiroshi, Takano, Takamasa, Tanaka, Masaya, Mawatari, Hiroshi, Kitayama, Daisuke, Tai, Takahiro, Tsunoda, Tsuyoshi, Kuramochi, Satoru
المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :836-844 May, 2022
Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
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5كتاب إلكتروني
المؤلفون: Ng, Peh SangAff5, Lim, Huai TeinAff5, Yeong, Wai ChungAff6, Saha, SajalAff7
المساهمون: Xhafa, Fatos, Series EditorAff1, Bee Wah, Yap, editorAff2, Al-Jumeily OBE, Dhiya, editorAff3, Berry, Michael W., editorAff4
المصدر: Data Science and Emerging Technologies : Proceedings of DaSET 2023. 191:545-561
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6مؤتمر
المؤلفون: Abdennadher, Salem
المصدر: 2021 IEEE International Conference on Design & Test of Integrated Micro & Nano-Systems (DTS) Design & Test of Integrated Micro & Nano-Systems (DTS), 2021 IEEE International Conference on. :1-7 Jun, 2021
Relation: 2021 IEEE International Conference on Design & Test of Integrated Micro & Nano-Systems (DTS)
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7مؤتمر
المؤلفون: Rotaru, Mihai Dragos, Kangrong, Li
المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :334-339 Jun, 2021
Relation: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
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8دورية أكاديمية
المؤلفون: Tapia, Sebastián M., Macías, Laura G., Pérez-Torrado, Roberto, Daroqui, Noemi, Manzanares, Paloma, Querol, Amparo, Barrio, EladioAff1, Aff2, IDs12915023015666_cor7
المصدر: BMC Biology. 21(1)
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9دورية أكاديمية
المؤلفون: Wade, M., Anderson, E., Ardalan, S., Bhargava, P., Buchbinder, S., L. Davenport, M., Fini, J., Lu, H., Li, C., Meade, R., Ramamurthy, C., Rust, M., Sedgwick, F., Stojanovic, V., Van Orden, D., Zhang, C., Sun, C., Shumarayev, S.Y., O'Keeffe, C., Hoang, T.T., Kehlet, D., Mahajan, R.V., Guzy, M.T., Chan, A., Tran, T.
المصدر: IEEE Micro Micro, IEEE. 40(2):63-71 Apr, 2020
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10دورية أكاديمية
المؤلفون: Chintya Angesty, Eta Farmacelia Nurulhady, Sukarjo Waluyo
المصدر: Diglosia, Vol 7, Iss 1 (2024)
مصطلحات موضوعية: Aib dan Nasib, poverty, Robert Chambes, rural communities, sociology of literature, Language and Literature
وصف الملف: electronic resource