يعرض 1 - 10 نتائج من 49 نتيجة بحث عن '"Abdul Aziz, Mohd Sharizal"', وقت الاستعلام: 0.89s تنقيح النتائج
  1. 1
    دورية أكاديمية
    Effect of Exhaust Gas Flow Rate in Heat Recovery Steam Generator Duct Using Computational Fluid Dynamic Approach

    المؤلفون: Vikhraman, M., Abdul Aziz, Mohd SharizalAff1, IDs13369023086570_cor2, Khor, C. Y., Zainol, Mohd Remy Rozainy Mohd Arif

    المصدر: Arabian Journal for Science and Engineering. 49(8):11271-11287

    Find this article in full text from Springer Verlag. Full Text Finder
    أضف إلى المفضلة
  2. 2
    دورية أكاديمية
    Effect of Blade number on the Energy Dissipation and Centrifugal Pump Performance Based on the Entropy Generation Theory and Fluid–Structure Interaction

    المؤلفون: Sakran, Hayder KareemAff1, Aff2, Abdul Aziz, Mohd SharizalAff1, IDs1336902308606x_cor2, Khor, C. Y.

    المصدر: Arabian Journal for Science and Engineering. 49(8):11031-11052

    Find this article in full text from Springer Verlag. Full Text Finder
    أضف إلى المفضلة
  3. 3
    دورية أكاديمية
    Blade Exit Angle Impact on Centrifugal Pump Performance: Entropy Generation and Fluid–Structure Interaction Analysis

    المؤلفون: Sakran, Hayder KareemAff1, Aff2, Abdul Aziz, Mohd SharizalAff1, IDs13369024092005_cor2, Khor, C. Y.

    المصدر: Arabian Journal for Science and Engineering. :1-17

    Find this article in full text from Springer Verlag. Full Text Finder
    أضف إلى المفضلة
  4. 4
    دورية أكاديمية
    Impact of Cu Pillar Bump Diameter and Solder Material on Reflow Soldering: A Computational Study with Thermal Fluid–Structure Interaction

    المؤلفون: Lee, Jing Rou, Abdul Aziz, Mohd SharizalAff1, IDs11664023108553_cor2, Khor, Chu Yee, Ishak, Mohammad Hafifi Hafiz, Kamarudin, Roslan, Ani, F. Che

    المصدر: Journal of Electronic Materials. 53(3):1201-1213

    Find this article in full text from Springer Verlag. Full Text Finder
    أضف إلى المفضلة
  5. 5
    دورية أكاديمية
    Numerical Analysis of the Thermal and Mechanical Performance of Cu Pillar Bumps During Reflow: Effects of Height and Solder Material

    المؤلفون: Lee, Jing Rou, Chong, Mun Xi, Abdul Aziz, Mohd SharizalAff1, IDs11664023107823_cor3, Khor, Chu Yee, Mohd Salleh, Mohd Arif Anuar, Mohd Arif Zainol, Mohd Remy Rozainy, Ani, F. Che

    المصدر: Journal of Electronic Materials. 53(3):1169-1182

    Find this article in full text from Springer Verlag. Full Text Finder
    أضف إلى المفضلة
  6. 6
    دورية أكاديمية
    Experimental and numerical investigation of an innovative desalination unit under laminar, transient, and turbulent flow conditions

    المؤلفون: Ahmed, Faizan, Abdul Aziz, Mohd Sharizal, Shaik, Feroz, Khor, C.Y.

    المصدر: In Chemical Engineering Research and Design August 2024 208:683-694

    View record from ScienceDirect Full Text Finder
    أضف إلى المفضلة
  7. 7
    كتاب إلكتروني
    Influence of Epoxy Viscosity on Led Encapsulation Process

    المؤلفون: Jaludin, A. A. A.Aff5, Abdul Aziz, Mohd SharizalAff6, Shing, Goh WeiAff6, Ishak, M. H. H.Aff5, Rusdi, Mohd SyakirinAff5, Ahmad, M. I.Aff7

    المساهمون: Mohd Salleh, Mohd Arif Anuar, editorAff1, Che Halin, Dewi Suriyani, editorAff2, Abdul Razak, Kamrosni, editorAff3, Ramli, Mohd Izrul Izwan, editorAff4

    المصدر: Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium : EPITS 2022, 14-15 September, Langkawi, Malaysia. 289:73-81

    أضف إلى المفضلة
  8. 8
    كتاب إلكتروني
    The Effect of the Epoxy Curing Method on the Encapsulation of Led

    المؤلفون: Muniary, KaalidassAff5, Rusdi, Mohd SyakirinAff5, Abdul Aziz, Mohd SharizalAff5, Kamaruddin, RoslanAff5, Ishak, M. H. H.Aff6, Alim, Md. AbdulAff7, Mohd Salleh, Mohd Arif AnuarAff8

    المساهمون: Mohd Salleh, Mohd Arif Anuar, editorAff1, Che Halin, Dewi Suriyani, editorAff2, Abdul Razak, Kamrosni, editorAff3, Ramli, Mohd Izrul Izwan, editorAff4

    المصدر: Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium : EPITS 2022, 14-15 September, Langkawi, Malaysia. 289:153-164

    أضف إلى المفضلة
  9. 9
    كتاب إلكتروني
    Effect of Different Epoxy Materials During LED Wire Bonding Encapsulation Process Using CFD Approach

    المؤلفون: Zubir, Muhammad Syukri BinAff5, Rusdi, Mohd Syakirin BinAff5, Abdul Aziz, Mohd SharizalAff5, Kamaruddin, RoslanAff5, Ishak, M. H. H.Aff6, Mohd Salleh, Mohd Arif AnuarAff7

    المساهمون: Mohd Salleh, Mohd Arif Anuar, editorAff1, Che Halin, Dewi Suriyani, editorAff2, Abdul Razak, Kamrosni, editorAff3, Ramli, Mohd Izrul Izwan, editorAff4

    المصدر: Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium : EPITS 2022, 14-15 September, Langkawi, Malaysia. 289:123-132

    أضف إلى المفضلة
  10. 10
    كتاب إلكتروني
    Investigation of Thermal Reflow Profile for Copper Pillar Technology

    المؤلفون: Lee, Jing RouAff5, Abdul Aziz, Mohd SharizalAff5, Rosli, Muhammad Faiz RidhwanAff5, Rusdi, Mohd SyakirinAff5, Kamaruddin, RoslanAff5, Ishak, M. H. H.Aff6, Mohd Salleh, Mohd Arif AnuarAff7

    المساهمون: Mohd Salleh, Mohd Arif Anuar, editorAff1, Che Halin, Dewi Suriyani, editorAff2, Abdul Razak, Kamrosni, editorAff3, Ramli, Mohd Izrul Izwan, editorAff4

    المصدر: Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium : EPITS 2022, 14-15 September, Langkawi, Malaysia. 289:83-91

    أضف إلى المفضلة
أدوات البحث: أحصل على تغذية RSS – أرسل هذا البحث بالبريد الإلكتروني – حفظ البحث – جدول التنبيهات: لا شيء