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المؤلفون: Shafaat Ahmed, Ketan Shah, Craig Child, Stephan Grunow, Dinesh Koli, Anbu Selvam Km Mahalingam, Adam da Silva, Tien-Jen Cheng, Mukta Sharma, Teng-Yin Lin
المصدر: 2017 28th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
مصطلحات موضوعية: Void (astronomy), Interconnection, Yield (engineering), Plating, Nucleation, Wafer, Composite material, Electroplating, Die (integrated circuit)
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::298867b129379d7d6b064f65fb42d6cc
https://doi.org/10.1109/asmc.2017.7969191 -
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المؤلفون: Anbu Selvam Km Mahalingam, San Leong Liew, Prakash Periasamy, Craig Child, Jeric Sarad, Adam da Silva
المصدر: 2016 27th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC).
مصطلحات موضوعية: Interconnection, Materials science, business.industry, Annealing (metallurgy), Design of experiments, chemistry.chemical_element, Current ramp, Copper, Electromigration, chemistry, Technology scaling, Electronic engineering, Optoelectronics, Undercut, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::5993c83a5f8ba70ff08c0ddedd79d82b
https://doi.org/10.1109/asmc.2016.7491147