المؤلفون: Huang, Wei-Chen, Tsai, Chin-Hao, Kao, C. R.

المصدر: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) Electronics System-Integration Technology Conference (ESTC), 2022 IEEE 9th. :326-329 Sep, 2022

Relation: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)

المؤلفون: Wei Chen Huang, Chin Hao Tsai, Pei Tzu Lee, C.R. Kao

المصدر: Journal of Materials Research and Technology, Vol 19, Iss , Pp 3828-3841 (2022)

مصطلحات موضوعية: Power device packaging, Interconnection, Die attach, Ag–Sn alloy Sintering, Cu–Sn intermetallic Compound, Mechanical properties, Mining engineering. Metallurgy, TN1-997

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2238785422009772; https://doaj.org/toc/2238-7854

URL الوصول: https://doaj.org/article/271ba08dba8d40179d1620b1bd9d3451

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