-
1دورية أكاديمية
المؤلفون: Tharani Ambreen, Parpio Yasmin, Farooq Salima, Ahmer Syed, Iqbal Saleem P, Khan Rashid AM, Zaman Mohammad
المصدر: Substance Abuse Treatment, Prevention, and Policy, Vol 6, Iss 1, p 19 (2011)
مصطلحات موضوعية: Public aspects of medicine, RA1-1270, Social pathology. Social and public welfare. Criminology, HV1-9960
وصف الملف: electronic resource
-
2دورية أكاديمية
المؤلفون: Iqbal Saman, Bhutto Naila, Syed Ehsanullah, Ahmer Syed, Yousafzai Abdul, Siddiqi Mohammed, Zaman Mohammed
المصدر: Annals of General Psychiatry, Vol 8, Iss 1, p 8 (2009)
مصطلحات موضوعية: Psychiatry, RC435-571
وصف الملف: electronic resource
-
3دورية أكاديمية
المؤلفون: Khan Rashid AM, Ahmer Syed, Iqbal Saleem
المصدر: Annals of General Psychiatry, Vol 7, Iss 1, p 12 (2008)
مصطلحات موضوعية: Psychiatry, RC435-571
وصف الملف: electronic resource
-
4دورية أكاديمية
المؤلفون: Faruqui Rafey A, Ahmer Syed, Aijaz Anita
المصدر: BMC Psychiatry, Vol 7, Iss 1, p 59 (2007)
مصطلحات موضوعية: Psychiatry, RC435-571
وصف الملف: electronic resource
-
5
المؤلفون: Pavan Rajmane, Ahmer Syed, Mark Schwarz, Karthikeyan Dhandapani
المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: Interconnection, System in package, Reliability (semiconductor), business.industry, Computer science, Time to market, New product development, Electronics, business, Finite element method, Die (integrated circuit), Reliability engineering
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::10f4da10e99d89af2230797a6a2cfd68
https://doi.org/10.1109/ectc32696.2021.00240 -
6دورية أكاديمية
المؤلفون: Ahmer, Syed, Yousafzai, Abdul-Wahab, Siddiqi, Mohammad, Faruqui, Rafey, Khan, Rashid, Zuberi, Saman
المصدر: Academic Psychiatry. July 2009 33(4):335-339
-
7
المؤلفون: Ahmer Syed, Mark Schwarz, Dongming He, Wei Zhao, Xuefeng Zhang, Lily Zhao, Wei Wang, Mark Nakamoto
المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: Thermal copper pillar bump, Strain energy release rate, Shear (sheet metal), Back end of line, Materials science, Shear force, Fracture mechanics, Direct shear test, Composite material, Failure mode and effects analysis
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::6b8853bda1d55e28ca4938aac00fb355
https://doi.org/10.1109/ectc32862.2020.00048 -
8
المؤلفون: Ahmer Syed
المصدر: International Symposium on Microelectronics. 2017:000001-000023
مصطلحات موضوعية: business.industry, Phone, Computer science, Embedded system, Automotive Engineering, Hardware_INTEGRATEDCIRCUITS, Integrated circuit design, business, Mobile device
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::f4a19e42b19d4e9ef1f5ed52aa3c1efb
https://doi.org/10.4071/isom-2017-slide-1 -
9
المؤلفون: Riko Radojcic, Karthikeyan Dhandapani, Ahmer Syed, Ron Lindley, Wei Zhao, Mark Schwarz, Mark Nakamoto, Vidhya Ramachandran, Urmi Ray, Aurel Gunterus, Brian Matthew Henderson
المصدر: International Symposium on Microelectronics. 2017:000325-000330
مصطلحات موضوعية: 010302 applied physics, Engineering, business.industry, 020208 electrical & electronic engineering, Electrical engineering, Hardware_PERFORMANCEANDRELIABILITY, 02 engineering and technology, Integrated circuit design, Chip, 01 natural sciences, law.invention, Printed circuit board, Particle board, law, 0103 physical sciences, Automotive Engineering, Hardware_INTEGRATEDCIRCUITS, 0202 electrical engineering, electronic engineering, information engineering, Electronic engineering, Wafer testing, business, Wafer-level packaging, Flip chip
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::7e234c9e8cbe22c1074d3a9857fb3c1f
https://doi.org/10.4071/isom-2017-wp11_048 -
10
المؤلفون: Ahmer Syed, Xuefeng Zhang, Yangyang Sun, Wei Wang, Mark Schwarz, Bill Stone, Lily Zhao, Lejun Wang
المصدر: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: Stress (mechanics), Thermal copper pillar bump, Materials science, Soldering, Delamination, Mechanical engineering, Chip, Failure mode and effects analysis, Flip chip, Die (integrated circuit)
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::bfbeb9ea224ab3d2c80bd4a21c1bde09
https://doi.org/10.1109/ectc.2019.00066