المؤلفون: Kumar, R Vinod, Kannan, M Ajay, Arunkumar, S

المصدر: 2024 3rd International Conference on Applied Artificial Intelligence and Computing (ICAAIC) Applied Artificial Intelligence and Computing (ICAAIC), 2024 3rd International Conference on. :1659-1664 Jun, 2024

Relation: 2024 3rd International Conference on Applied Artificial Intelligence and Computing (ICAAIC)

المؤلفون: Sanganaboina, Ajay Bhaskar, Ruttala, Sandeep, Mandadapu, Hrushikesh, Kanigiri, Sai Venkata Uma Maheswararao, Deva Kumar, S, Venkatrama Phani Kumar, S

المصدر: 2024 3rd International Conference on Applied Artificial Intelligence and Computing (ICAAIC) Applied Artificial Intelligence and Computing (ICAAIC), 2024 3rd International Conference on. :1880-1886 Jun, 2024

Relation: 2024 3rd International Conference on Applied Artificial Intelligence and Computing (ICAAIC)

المؤلفون: Dcunha, Axill Ajay, Gonsalves, Jessica Allen, Gonsalves, Lisban Robert, Gonsalves, Jason Johnson, Gaur, Nidhi

المصدر: 2024 3rd International Conference on Applied Artificial Intelligence and Computing (ICAAIC) Applied Artificial Intelligence and Computing (ICAAIC), 2024 3rd International Conference on. :1613-1618 Jun, 2024

Relation: 2024 3rd International Conference on Applied Artificial Intelligence and Computing (ICAAIC)

المؤلفون: Jin, Zhiyang, Liu, Yang, Cruz, Alfonso, Sukhwani, Ajay S., Krishnan, Antariksh R., Langston, Gabriel J., Ghosh, Shreya, Uhrik, Theodore, Kalaitzidou, Kyriaki, Graber, Lukas

المصدر: 2024 IEEE Electrical Insulation Conference (EIC) Electrical Insulation Conference (EIC), 2024 IEEE. :180-183 Jun, 2024

Relation: 2024 IEEE Electrical Insulation Conference (EIC)

المؤلفون: Talukdar, Tushar, Elsherbini, Adel, Rawlings, Brandon, Vreeland, Richard, Brezinski, William, Dong, Siyan, Niazi, Haris Khan, Liu, Pilin, Shi, Yi, Tabassum, Natasha, Sathe, Ajay, Ajayi, Taiwo, Bedoya, Felipe, Tiagaraj, Sathya Narasimman, Pasdast, Gerald, Jun, Kimin, Brun, Xavier, Swan, Johanna

المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :784-789 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

المؤلفون: Khurana, Suman, Malik, Ajay, Narwal, Sonia, Agarwal, Gaurav, Sangwan, Kavita

المصدر: 2024 International Conference on Computational Intelligence and Computing Applications (ICCICA) Computational Intelligence and Computing Applications (ICCICA), 2024 International Conference on. 1:454-458 May, 2024

Relation: 2024 International Conference on Computational Intelligence and Computing Applications (ICCICA)

المؤلفون: Rahi, Parvez, Singh, Ajay Pal, Singh, Inderjeet, Thakur, Mannat, Mahajan, Yash

المصدر: 2024 International Conference on Computational Intelligence and Computing Applications (ICCICA) Computational Intelligence and Computing Applications (ICCICA), 2024 International Conference on. 1:564-570 May, 2024

Relation: 2024 International Conference on Computational Intelligence and Computing Applications (ICCICA)

المؤلفون: Rahi, Parvez, Singh, Ajay Pal, Singh, Inderjeet, Verma, Manav, Thakur, Mannat

المصدر: 2024 International Conference on Computational Intelligence and Computing Applications (ICCICA) Computational Intelligence and Computing Applications (ICCICA), 2024 International Conference on. 1:387-393 May, 2024

Relation: 2024 International Conference on Computational Intelligence and Computing Applications (ICCICA)

المؤلفون: Bhooshan, Rishi, Reber, Doug, Jain, Shreyans, Sharma, Ajay Kumar

المصدر: 2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa) Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa), 2024 IEEE Joint International Symposium on. :556-559 May, 2024

Relation: 2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa)

المؤلفون: Raut, Atharva, Kadam, Abhishek A., Singh, Ajay K., Somappa, Laxmeesha, Baghini, Maryam Shojaei, Ganguly, Udayan

المصدر: 2024 IEEE International Symposium on Circuits and Systems (ISCAS) Circuits and Systems (ISCAS), 2024 IEEE International Symposium on. :1-5 May, 2024

Relation: 2024 IEEE International Symposium on Circuits and Systems (ISCAS)