المؤلفون: Sun, X., Cao, W., Crafton, B., Akarvardar, K., Mori, H., Fujiwara, H., Noguchi, H., Chih, Y., Chang, M., Wang, Y., Chang, T.J.

المصدر: IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst. Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on. 43(4):1191-1205 Apr, 2024

المؤلفون: Akarvardar, K., Wong, H.-.P.

المصدر: Proceedings of the IEEE Proc. IEEE Proceedings of the IEEE. 111(1):92-112 Jan, 2023

المؤلفون: Sun, X., Khwa, W.S., Chen, Y.S., Lee, C.H., Lee, H.Y., Yu, S.M., Naous, R., Wu, J.Y., Chen, T.C., Bao, X., Chang, M.F., Diaz, C.H., Wong, H.P., Akarvardar, K.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 68(11):5585-5591 Nov, 2021

المؤلفون: Sinangil, M.E., Erbagci, B., Naous, R., Akarvardar, K., Sun, D., Khwa, W., Liao, H., Wang, Y., Chang, J.

المصدر: IEEE Journal of Solid-State Circuits IEEE J. Solid-State Circuits Solid-State Circuits, IEEE Journal of. 56(1):188-198 Jan, 2021

المؤلفون: Wong, H.P., Akarvardar, K., Antoniadis, D., Bokor, J., Hu, C., King-Liu, T., Mitra, S., Plummer, J.D., Salahuddin, S.

المصدر: Proceedings of the IEEE Proc. IEEE Proceedings of the IEEE. 108(4):478-482 Apr, 2020

المؤلفون: Khwa, W. S., Akarvardar, K., Chen, Y. S., Chiu, Y. C., Liu, J. C., Wu, J. J., Lee, H. Y., Yu, S. M., Lee, C. H., Chen, T. C., Lin, Y. C., Hsu, C. F., Lee, T. Y., Ku, T. K., Kuo, C. H., Wu, J. Y., Bao, X. Y., Chang, C. S., Chih, Y. D., Wong, H.-S. P., Chang, M. F.

المصدر: 2021 Symposium on VLSI Technology VLSI Technology, 2021 Symposium on. :1-2 Jun, 2021

Relation: 2021 Symposium on VLSI Technology

المؤلفون: Wong, H.-.P., Akarvardar, K., Antoniadis, D., Bokor, J., Hu, C., King-Liu, T.-., Mitra, S., Plummer, J.D., Salahuddin, S., Deng, L., Li, G., Han, S., Shi, L., Xie, Y., Yaacoub, E., Alouini, M., Douik, A., Dahrouj, H., Al-Naffouri, T.Y.

المصدر: Proceedings of the IEEE Proc. IEEE Proceedings of the IEEE. 108(4):483-484 Apr, 2020

المؤلفون: Ok, I., Loh, W. Y., Ang, K-W, Young, C. D., Hung, P. Y., Ngai, T., Akarvardar, K., Hobbs, C., Jammy, R.

المصدر: 11th International Workshop on Junction Technology (IWJT) Junction Technology (IWJT), 2011 11th International Workshop on. :50-54 Jun, 2011

Relation: 2011 11th International Workshop on Junction Technology (IWJT)

المؤلفون: Hinchet, R., Montes, L., Bouteloup, G., Ardila, G., Parsa, R., Akarvardar, K., Howe, R. T., Wong, H.-S. Philip

المصدر: 2011 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP) Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2011 Symposium on. :348-351 May, 2011

Relation: 2011 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)

المؤلفون: Akarvardar, K., Cristoloveanu, S., Dufrene, B., Gentil, P., Schrimpf, R.D., Blalock, B.J., Chroboczek, J.A., Mojarradi, M.

المصدر: Proceedings of 35th European Solid-State Device Research Conference, 2005. ESSDERC 2005. Solid-State Device Research Conference Solid-State Device Research Conference, 2005. ESSDERC 2005. Proceedings of 35th European. :89-92 2005

Relation: Proceedings of ESSDERC 2005. 31st European Solid-State Device Research Conference