المؤلفون: Emersic, Z., Ohki, T., Akasaka, M., Arakawa, T., Maeda, S., Okano, M., Sato, Y., George, A., Marcel, S., Ganapathi, I. I., Ali, S. S., Javed, S., Werghi, N., Isik, S. G., Saritas, E., Ekenel, H. K., Hudovernik, V., Kolf, J. N., Boutros, F., Damer, N., Sharma, G., Kamboj, A., Nigam, A., Jain, D. K., Camara-Chavez, G., Peer, P., Struc, V.

المصدر: 2023 IEEE International Joint Conference on Biometrics (IJCB) Biometrics (IJCB), 2023 IEEE International Joint Conference on. :1-10 Sep, 2023

Relation: 2023 IEEE International Joint Conference on Biometrics (IJCB)

المؤلفون: Kubo Y, Ogasawara K, Akira Kurose, Kashimura H, Koji T, Otawara Y, Kamei J, Akasaka M, Sasaki M, Ogawa A

المصدر: Vascular Health and Risk Management, Vol Volume 7, Pp 667-670 (2011)

مصطلحات موضوعية: full-term neonate, hemorrhagic cerebral infarction, patent foramen ovale, surgery, Diseases of the circulatory (Cardiovascular) system, RC666-701

وصف الملف: electronic resource

Relation: https://www.dovepress.com/hemorrhagic-infarction-at-33-days-after-birth-in-a-healthy-full-term-n-peer-reviewed-article-VHRM; https://doaj.org/toc/1178-2048

URL الوصول: https://doaj.org/article/99d903206ea340a6a2e5f98972ae455d

المؤلفون: Soga, J., Iida, T., Higuchi, Y., Sakuma, T., Makino, K., Akasaka, M., Nemoto, T., Takanashi, Y.

المصدر: ICT 2005. 24th International Conference on Thermoelectrics, 2005. Thermoelectrics Thermoelectrics, 2005. ICT 2005. 24th International Conference on. :95-98 2005

Relation: 2005 24th International Conference on Thermoelectrics (ICT)

المؤلفون: Akasaka, M., Iida, T., Matsui, S., Furuyama, S., Kobayashi, T., Takanashi, Y.

المصدر: ICT 2005. 24th International Conference on Thermoelectrics, 2005. Thermoelectrics Thermoelectrics, 2005. ICT 2005. 24th International Conference on. :114-117 2005

Relation: 2005 24th International Conference on Thermoelectrics (ICT)

المؤلفون: Fujimori, S., Endoh, T., Mitsuboshi, K., Ishiwata, K., Akasaka, M., Hiruta, S.

المصدر: Proceedings of 1995 IEEE 5th International Conference on Conduction and Breakdown in Solid Dielectrics Conduction and breakdown in solid dielectrics Conduction and Breakdown in Solid Dielectrics, 1995. ICSD'95., Proceedings of the 1995 IEEE 5th International Conference on. :185-189 1995

Relation: Proceedings of 1995 IEEE 5th International Conference on Conduction and Breakdown in Solid Dielectrics

المؤلفون: Fujimori, S., Endoh, T., Mitsuboshi, K., Ishiwata, K., Akasaka, M., Hiruta, S.

المصدر: Proceedings of 1995 IEEE 5th International Conference on Conduction and Breakdown in Solid Dielectrics Conduction and breakdown in solid dielectrics Conduction and Breakdown in Solid Dielectrics, 1995. ICSD'95., Proceedings of the 1995 IEEE 5th International Conference on. :376-380 1995

Relation: Proceedings of 1995 IEEE 5th International Conference on Conduction and Breakdown in Solid Dielectrics

المؤلفون: Fujimori, S., Hiruta, S., Akasaka, M., Endoh, T., Ishiwata, K.

المصدر: Proceedings of 1994 4th International Conference on Properties and Applications of Dielectric Materials (ICPADM) Dielectric materials properties and applications Properties and Applications of Dielectric Materials, 1994., Proceedings of the 4th International Conference on. 1:448-451 vol.1 1994

Relation: Proceedings of 1994 4th International Conference on Properties and Applications of Dielectric Materials (ICPADM)

المؤلفون: Fujimori, S., Akasaka, M., Hiruta, S., Endoh, T., Ishiwata, K.

المصدر: Proceedings of 1994 4th International Conference on Properties and Applications of Dielectric Materials (ICPADM) Dielectric materials properties and applications Properties and Applications of Dielectric Materials, 1994., Proceedings of the 4th International Conference on. 1:432-435 vol.1 1994

Relation: Proceedings of 1994 4th International Conference on Properties and Applications of Dielectric Materials (ICPADM)

المؤلفون: Nemoto, T., Akasaka, M., Iida, T., Sato, J., Nishio, K., Takei, T., Takanashi, Y.

المصدر: 2006 25th International Conference on Thermoelectrics Thermoelectrics, 2006. ICT '06. 25th International Conference on. :552-555 Aug, 2006

Relation: 2006 25th International Conference on Thermoelectrics

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