المؤلفون: Akbari, Saeed, Martins, Joao, Lopes, Rui Amaral

المصدر: 2024 IEEE 18th International Conference on Compatibility, Power Electronics and Power Engineering (CPE-POWERENG) Compatibility, Power Electronics and Power Engineering (CPE-POWERENG), 2024 IEEE 18th International Conference on. :1-5 Jun, 2024

Relation: 2024 IEEE 18th International Conference on Compatibility, Power Electronics and Power Engineering (CPE-POWERENG)

المؤلفون: Akbari, Saeed, Holmberg, Jonas, Andersson, Dag, Mishra, Madhav, Brinkfeldt, Klas

المصدر: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023 24th International Conference on. :1-6 Apr, 2023

Relation: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

المؤلفون: Akbari, Saeed, Kostov, Konstantin, Brinkfeldt, Klas, Bakowski, Mietek, Andersson, Dag

المصدر: 2022 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) Microelectronics Packaging (NordPac), 2022 IMAPS Nordic Conference on. :1-7 Jun, 2022

Relation: 2022 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)

المؤلفون: Akbari, Saeed^{Aff17, Aff18}, Camarinha-Matos, Luis M.^{Aff17, Aff18}, Martins, Joao^{Aff17, Aff18}

المساهمون: Rannenberg, Kai, Editor-in-Chief^Aff1, Soares Barbosa, Luís, Editorial Board Member^Aff2, Carette, Jacques, Editorial Board Member^Aff3, Tatnall, Arthur, Editorial Board Member^Aff4, Neuhold, Erich J., Editorial Board Member^Aff5, Stiller, Burkhard, Editorial Board Member^Aff6, Stettner, Lukasz, Editorial Board Member^Aff7, Pries-Heje, Jan, Editorial Board Member^Aff8, Kreps, David, Editorial Board Member^Aff9, Rettberg, Achim, Editorial Board Member^Aff10, Furnell, Steven, Editorial Board Member^Aff11, Mercier-Laurent, Eunika, Editorial Board Member^Aff12, Winckler, Marco, Editorial Board Member^Aff13, Malaka, Rainer, Editorial Board Member^Aff14, Camarinha-Matos, Luis M., editor^Aff15, Ferrada, Filipa, editor^Aff16

المصدر: Technological Innovation for Human-Centric Systems : 15th IFIP WG 5.5/SOCOLNET Advanced Doctoral Conference on Computing, Electrical and Industrial Systems, DoCEIS 2024, Caparica, Portugal, July 3–5, 2024, Proceedings. 716:43-60

المؤلفون: Akbari, Saeed, Pawar, Suraj, San, Omer

مصطلحات موضوعية: Physics - Computational Physics

URL الوصول: http://arxiv.org/abs/2212.05384

المؤلفون: Akbari, Saeed, Sheikhkhoshkar, Moslem, Pour Rahimian, Farzad, El Haouzi, Hind Bril, Najafi, Mina, Talebi, Saeed

المصدر: In Automation in Construction July 2024 163

المؤلفون: Akbari, Saeed, Lopes, Rui Amaral, Martins, João

المصدر: In International Journal of Electrical Power and Energy Systems July 2024 158

المؤلفون: Akbari, Saeed, Hashemi-Dezaki, Hamed, Martins, João

المصدر: In Energy Reports December 2024 12:1638-1654

المؤلفون: Akbari, Saeed, Moabber, Kooros, Kostov, Konstantin Stoychev, Bakowski, Mietek, Lim, Jang-Kwon, Brinkfeldt, Klas

المصدر: PCIM Europe Conference Proceedings. :2089-2098

مصطلحات موضوعية: Electric locomotives, Fracture mechanics, Silver powder metallurgy, Ceramic substrates, Damage distribution, Damage evolution, Double sided, Mechanical constraints, Parametric study, Parasitic inductances, Power electronics modules, Thermal, Wide band gap devices, Sintering

وصف الملف: print

URL الوصول: https://urn.kb.se/resolve?urn=urn:nbn:se:ri:diva-75033

المؤلفون: Lovberg, Andreas, Tegehall, Per-Erik, Akbari, Saeed, Andersson, Dag

المصدر: 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2018 19th International Conference on. :1-13 Apr, 2018

Relation: 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)