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1مؤتمر
المؤلفون: Akbari, Saeed, Martins, Joao, Lopes, Rui Amaral
المصدر: 2024 IEEE 18th International Conference on Compatibility, Power Electronics and Power Engineering (CPE-POWERENG) Compatibility, Power Electronics and Power Engineering (CPE-POWERENG), 2024 IEEE 18th International Conference on. :1-5 Jun, 2024
Relation: 2024 IEEE 18th International Conference on Compatibility, Power Electronics and Power Engineering (CPE-POWERENG)
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2مؤتمر
المؤلفون: Akbari, Saeed, Holmberg, Jonas, Andersson, Dag, Mishra, Madhav, Brinkfeldt, Klas
المصدر: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023 24th International Conference on. :1-6 Apr, 2023
Relation: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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3مؤتمر
المصدر: 2022 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) Microelectronics Packaging (NordPac), 2022 IMAPS Nordic Conference on. :1-7 Jun, 2022
Relation: 2022 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)
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4كتاب إلكتروني
المؤلفون: Akbari, SaeedAff17, Aff18, Camarinha-Matos, Luis M.Aff17, Aff18, Martins, JoaoAff17, Aff18
المساهمون: Rannenberg, Kai, Editor-in-ChiefAff1, Soares Barbosa, Luís, Editorial Board MemberAff2, Carette, Jacques, Editorial Board MemberAff3, Tatnall, Arthur, Editorial Board MemberAff4, Neuhold, Erich J., Editorial Board MemberAff5, Stiller, Burkhard, Editorial Board MemberAff6, Stettner, Lukasz, Editorial Board MemberAff7, Pries-Heje, Jan, Editorial Board MemberAff8, Kreps, David, Editorial Board MemberAff9, Rettberg, Achim, Editorial Board MemberAff10, Furnell, Steven, Editorial Board MemberAff11, Mercier-Laurent, Eunika, Editorial Board MemberAff12, Winckler, Marco, Editorial Board MemberAff13, Malaka, Rainer, Editorial Board MemberAff14, Camarinha-Matos, Luis M., editorAff15, Ferrada, Filipa, editorAff16
المصدر: Technological Innovation for Human-Centric Systems : 15th IFIP WG 5.5/SOCOLNET Advanced Doctoral Conference on Computing, Electrical and Industrial Systems, DoCEIS 2024, Caparica, Portugal, July 3–5, 2024, Proceedings. 716:43-60
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5تقرير
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6دورية أكاديميةSustainability and building information modelling: Integration, research gaps, and future directions
المؤلفون: Akbari, Saeed, Sheikhkhoshkar, Moslem, Pour Rahimian, Farzad, El Haouzi, Hind Bril, Najafi, Mina, Talebi, Saeed
المصدر: In Automation in Construction July 2024 163
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7دورية أكاديمية
المؤلفون: Akbari, Saeed, Lopes, Rui Amaral, Martins, João
المصدر: In International Journal of Electrical Power and Energy Systems July 2024 158
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8دورية أكاديمية
المؤلفون: Akbari, Saeed, Hashemi-Dezaki, Hamed, Martins, João
المصدر: In Energy Reports December 2024 12:1638-1654
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9
المؤلفون: Akbari, Saeed, Moabber, Kooros, Kostov, Konstantin Stoychev, Bakowski, Mietek, Lim, Jang-Kwon, Brinkfeldt, Klas
المصدر: PCIM Europe Conference Proceedings. :2089-2098
مصطلحات موضوعية: Electric locomotives, Fracture mechanics, Silver powder metallurgy, Ceramic substrates, Damage distribution, Damage evolution, Double sided, Mechanical constraints, Parametric study, Parasitic inductances, Power electronics modules, Thermal, Wide band gap devices, Sintering
وصف الملف: print
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10مؤتمر
المؤلفون: Lovberg, Andreas, Tegehall, Per-Erik, Akbari, Saeed, Andersson, Dag
المصدر: 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2018 19th International Conference on. :1-13 Apr, 2018
Relation: 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)