المؤلفون: Wang, Shihao, Zeng, Zhaoqin, Bao, Yu, Wang, Shasha, Zhou, Haifeng, Fang, Jingxun, Zhang, Yu

المصدر: 2022 China Semiconductor Technology International Conference (CSTIC) Semiconductor Technology International Conference (CSTIC), 2022 China. :1-4 Jun, 2022

Relation: 2022 China Semiconductor Technology International Conference (CSTIC)

المؤلفون: Liu, Zhejun, Liu, Liangkai, Cui, Yonghua, Huang, Ran, Xu, Ying, Zhou, Wei

المصدر: 2021 China Semiconductor Technology International Conference (CSTIC) Semiconductor Technology International Conference (CSTIC), 2021 China. :1-3 Mar, 2021

Relation: 2021 China Semiconductor Technology International Conference (CSTIC)

المؤلفون: Wang, Y., Zhang, Q., Li, P., Su, X., Dong, L., Chen, R., Zhang, L., Gai, T., Su, Y., Wei, Y., Ye, T.C.

المصدر: IEEE Journal of the Electron Devices Society IEEE J. Electron Devices Soc. Electron Devices Society, IEEE Journal of the. 9:6-9 2021

المؤلفون: Titov, V. N.^Aff1, Ternovikh, A. I., Baranov, P. V., Sidorova, T. Yu.

المصدر: Metallurgist. 65(3-4):439-445

المؤلفون: Ying-Fei Wang, Qing-Chun Zhang, Ping Li, Xiao-Jing Su, Li-Song Dong, Rui Chen, Li-Bin Zhang, Tian-Yang Gai, Ya-Juan Su, Ya-Yi Wei, Tian Chun Ye

المصدر: IEEE Journal of the Electron Devices Society, Vol 9, Pp 6-9 (2021)

مصطلحات موضوعية: Layout proximity effects, high-k HfO₂, stress memorization technique, Al diffusion, Electrical engineering. Electronics. Nuclear engineering, TK1-9971

وصف الملف: electronic resource

Relation: https://ieeexplore.ieee.org/document/9235562/; https://doaj.org/toc/2168-6734

URL الوصول: https://doaj.org/article/3269a09e61a045ebb74841b3612bc1ff

المؤلفون: Ban, Chunyan^Aff8, Wang, Chuhan^Aff8, Hu, Yimeng^Aff8, Liu, Lian^Aff8, Cui, Jianzhong^Aff8

المساهمون: Marquis, Fernand, editor^{Aff1, Aff2}

المصدر: Proceedings of the 8th Pacific Rim International Congress on Advanced Materials and Processing. :1277-1282

المؤلفون: Kim, Yongseok, Lee, Jeong-Min, Song, Hyunwoo, Han, Kyuchul, Koo, Jae-Mean, Lee, Young-Ze, Seok, Chang-Sung

المصدر: International Journal of Precision Engineering and Manufacturing-Green Technology. January 2017 4(1):67-72

المؤلفون: Yajuan Su, Qing-Chun Zhang, Ying-Fei Wang, Rui Chen, Tianyang Gai, Libin Zhang, Ping Li, Xiaojing Su, Lisong Dong, Yayi Wei, Tian Chun Ye

المصدر: IEEE Journal of the Electron Devices Society, Vol 9, Pp 6-9 (2021)

مصطلحات موضوعية: 010302 applied physics, Materials science, Dependency (UML), stress memorization technique, business.industry, Al diffusion, Process (computing), Layout proximity effects, 01 natural sciences, TK1-9971, Electronic, Optical and Magnetic Materials, Stress (mechanics), Logic gate, 0103 physical sciences, Trench, MOSFET, Hardware_INTEGRATEDCIRCUITS, Optoelectronics, Electrical engineering. Electronics. Nuclear engineering, Electrical and Electronic Engineering, business, Metal gate, high-k HfO₂, NMOS logic, Biotechnology

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::be32dc7e74a79960d46c8021a0621ec0
https://doi.org/10.1109/jeds.2020.3032957

المؤلفون: Jianbin Tong, Yi Liang, Shicheng Wei, Hongyi Su, Bo Wang, Yuzhong Ren, Yunlong Zhou, Zhongqi Sheng

المصدر: Materials, Vol 12, Iss 18, p 3032 (2019)

مصطلحات موضوعية: Zn-Al diffusion layer, mechanical energy aided diffusion, microstructure, corrosion resistance, electrochemistry, Technology, Electrical engineering. Electronics. Nuclear engineering, TK1-9971, Engineering (General). Civil engineering (General), TA1-2040, Microscopy, QH201-278.5, Descriptive and experimental mechanics, QC120-168.85

وصف الملف: electronic resource

Relation: https://www.mdpi.com/1996-1944/12/18/3032; https://doaj.org/toc/1996-1944

URL الوصول: https://doaj.org/article/dcfe5498868e4ab6bf6015a56b110988

المؤلفون: Bauer, Peter-Philipp, Swadzba, Radoslaw, Klamann, Lisa Marie, Laska, Nadine

مصطلحات موضوعية: General Chemical Engineering, Ti5Si3 interlayer Al diffusion Diffusion barrier γ-TiAl alloys Oxidation protective Al-Ti coating Mass gain analysis Magnetron sputtering, General Materials Science, General Chemistry

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::2b8d95aa91270bc6532098b593e39de4
https://elib.dlr.de/191188/