المؤلفون: Alam, Mohammad S.

وصف الملف: text

الإتاحة: https://www.accessscience.com/content/article/a251400

المؤلفون: Session, Deric, Mehrabad, Mahmoud Jalali, Paithankar, Nikil, Grass, Tobias, Eckhardt, Christian J., Cao, Bin, Forero, Daniel Gustavo Suárez, Li, Kevin, Alam, Mohammad S., Watanabe, Kenji, Taniguchi, Takashi, Solomon, Glenn S., Schine, Nathan, Sau, Jay, Sordan, Roman, Hafezi, Mohammad

مصطلحات موضوعية: Condensed Matter - Mesoscale and Nanoscale Physics, Quantum Physics

URL الوصول: http://arxiv.org/abs/2306.03417

المؤلفون: Hassan, KM Rafidh, Wu, Jing, Alam, Mohammad S., Suhling, Jeffrey C., Lall, Pradeep, Ryu, Geon Hong, Byun, Myunghwan

المصدر: 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2021 20th IEEE Intersociety Conference on. :933-940 Jun, 2021

Relation: 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)

المؤلفون: Wu, Jing, Hassan, KM Rafidh, Alam, Mohammad S., Suhling, Jeffrey C., Lall, Pradeep

المصدر: 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2021 20th IEEE Intersociety Conference on. :868-875 Jun, 2021

Relation: 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)

المؤلفون: Hassan, KM Rafidh, Wu, Jing, Alam, Mohammad S., Suhling, Jeffrey C., Lall, Pradeep

المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :937-945 Jun, 2021

Relation: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

المؤلفون: Ghatikar, Girish^{Aff1, Aff2, IDs42162023003004_cor1}, Alam, Mohammad S.^{Aff3, Aff4}

المصدر: Energy Informatics. 6(1)

المؤلفون: Wu, Jing, Alam, Mohammad S., Rafidh Hassan, KM, Suhling, Jeffrey C., Lall, Pradeep

المصدر: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2020 19th IEEE Intersociety Conference on. :1229-1238 Jul, 2020

Relation: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

المؤلفون: Hassan, KM Rafidh, Alam, Mohammad S., Wu, Jing, Suhling, Jeffrey C., Lall, Pradeep

المصدر: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2020 19th IEEE Intersociety Conference on. :1191-1200 Jul, 2020

Relation: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

المؤلفون: Wu, Jing, Alam, Mohammad S., Rafidh Hassan, KM, Suhling, Jeffrey C., Lall, Pradeep

المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :492-503 Jun, 2020

Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

المؤلفون: Hassan, KM Rafidh, Alam, Mohammad S., Wu, Jing, Suhling, Jeffrey C., Lall, Pradeep

المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :1894-1903 Jun, 2020

Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)