المؤلفون: Rideau, D., Uhring, W., Bianchi, R. A., Helleboid, R., Mugny, G., Grebot, J., Manouvrier, J.R., Neri, R., Brun, F., Lakeh, M. Dolatpoor, Rink, S., Kammerer, J-B., Lallement, C., Lacombe, E., Golanski, D., Rae, B., Bah, T. M., Twaddle, F., Quenette, V., Marchand, G., Buj, C., Fillon, R., Henrion, Y., Nicholson, I., Agnew, M., Basset, M., Perrier, R., Al-Rawhani, M., Mamdy, B., Pellegrin, S., Gouget, G., Maciazek, P., Juge, A., Dartigues, A., Alause, H. Wehbe

المصدر: ESSDERC 2023 - IEEE 53rd European Solid-State Device Research Conference (ESSDERC) Solid-State Device Research Conference (ESSDERC), ESSDERC 2023 - IEEE 53rd European. :144-147 Sep, 2023

Relation: ESSDERC 2023 - IEEE 53rd European Solid-State Device Research Conference (ESSDERC)

المؤلفون: Rideau, D., Oussaiti, Y., Grebot, J., Helleboid, R., Lopez, A., Mugny, G., Bourreau, E., Golanski, D., Mamdy, B., Alause, H. Wehbe, Nicholson, I., Pellegrini, S., Vlimant, C.E., Agnew, M., Cazimajou, T., Pala, M., Saint-Martin, J., Dollfus, P.

المصدر: 2021 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) Simulation of Semiconductor Processes and Devices (SISPAD), 2021 International Conference on. :293-296 Sep, 2021

Relation: 2021 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)

المؤلفون: Rideau, Denis, Oussaiti, Y., Grebot, J., Helleboid, R., Lopez, A., Mugny, G., Bourreau, E., Golanski, D., Mamdy, B., Alause, H. Wehbe, Nicholson, I., Pellegrini, S., Vlimant, C.E., Agnew, M., Cazimajou, T., Pala, M., Saint-Martin, Jérôme, Dollfus, P.

المساهمون: STMicroelectronics [Crolles] (ST-CROLLES), CEA-Direction des Energies (ex-Direction de l'Energie Nucléaire) (CEA-DES (ex-DEN)), Commissariat à l'énergie atomique et aux énergies alternatives (CEA), Centre de Nanosciences et de Nanotechnologies (C2N), Université Paris-Saclay-Centre National de la Recherche Scientifique (CNRS), Sept. 27-29, 2021, Virtual conference Dallas, US, saint-martin, Jérôme

المصدر: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD 2021)
International Conference on Simulation of Semiconductor Processes and Devices (SISPAD 2021), Sept. 27-29, 2021, Virtual conference Dallas, US, Sep 2021, Dallas, United States

مصطلحات موضوعية: [SPI.NANO] Engineering Sciences [physics]/Micro and nanotechnologies/Microelectronics, [SPI.NANO]Engineering Sciences [physics]/Micro and nanotechnologies/Microelectronics, [SPI.TRON] Engineering Sciences [physics]/Electronics, ComputingMilieux_MISCELLANEOUS, [SPI.TRON]Engineering Sciences [physics]/Electronics

URL الوصول: https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::d32e5f7a9766259e3012029483f9da88
https://hal.archives-ouvertes.fr/hal-03374008

المؤلفون: Rideau, D., Helleboid, R., Mugny, G., Bianchi, R. A., Manouvrier, J. R., Nicholson, I., Grebot, J., Lacombe, E., Lopez, A., Golanski, D., Mamdy, B., Rae, B., Pellegrini, S., Agnew, M., Uhring, W., Rink, S., Alause, H. Wehbe

المصدر: Proceedings of SPIE; 4/25/2023, Vol. 12512, p1251205-1251205, 1p

المؤلفون: Itzler, Mark A., Bienfang, Joshua C., McIntosh, K. Alex, Rideau, D., Helleboid, R., Mugny, G., Bianchi, R. A., Manouvrier, J. R., Nicholson, I., Grebot, J., Lacombe, E., Lopez, A., Golanski, D., Mamdy, B., Rae, B., Pellegrini, S., Agnew, M., Uhring, W., Rink, S., Alause, H. Wehbe

المصدر: Proceedings of SPIE; June 2023, Vol. 12512 Issue: 1 p1251205-1251205-6