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1
المؤلفون: Chia Li Han, Pei Shan Wu, Albert Lan, Xuan Ren Chen, Chung-Lieh Hung, Yuan Ling Hsu, Szu-Hua Pan, Pei Fang Hung
المصدر: Cancer Science
مصطلحات موضوعية: 0301 basic medicine, Male, Cancer Research, Glycosylation, Lung Neoplasms, Mice, SCID, Ligands, NSCLC, Metastasis, Mice, 0302 clinical medicine, N-linked glycosylation, Cell, Molecular, and Stem Cell Biology, Cell Movement, Carcinoma, Non-Small-Cell Lung, Medicine, Epidermal growth factor receptor, Phosphorylation, Membrane Glycoproteins, biology, Melanoma, N‐glycosylation, General Medicine, Middle Aged, Neoplasm Proteins, ErbB Receptors, Oncology, 030220 oncology & carcinogenesis, Female, Original Article, Signal Transduction, STAT3 Transcription Factor, Malignancy, GPNMB, 03 medical and health sciences, Cell Line, Tumor, Animals, Humans, metastasis, Neoplasm Invasiveness, Lung cancer, business.industry, Membrane Proteins, Original Articles, medicine.disease, 030104 developmental biology, Mutation, Cancer research, biology.protein, EGFR mutation, business
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2
المؤلفون: Ting-Jen R. Cheng, Chia-Jen Wang, Yuan-Ling Hsu, Albert Lan, Pan-Chyr Yang, Jyung-Hurng Liu, Chi-Huey Wong, Szu-Hua Pan, Tzu Hung Hsiao, Rong-Jie Chein, Pei-Fang Hung, Rou-Jie Huang, Chia-Yi Lin, Hsin-Yi Wu
المصدر: Journal of medicinal chemistry. 63(6)
مصطلحات موضوعية: Lung Neoplasms, medicine.drug_class, Phenotypic screening, Cell, Mice, Nude, Antineoplastic Agents, 01 natural sciences, Tyrosine-kinase inhibitor, Small Molecule Libraries, 03 medical and health sciences, Structure-Activity Relationship, Carcinoma, Non-Small-Cell Lung, Cell Line, Tumor, Drug Discovery, medicine, Structure–activity relationship, Animals, Humans, Enzyme Inhibitors, Lung cancer, Furans, 030304 developmental biology, Cell Proliferation, 0303 health sciences, Binding Sites, Minichromosome Maintenance Proteins, Molecular Structure, Chemistry, Ubiquitination, Cancer, medicine.disease, Small molecule, Xenograft Model Antitumor Assays, respiratory tract diseases, 0104 chemical sciences, High-Throughput Screening Assays, Molecular Docking Simulation, 010404 medicinal & biomolecular chemistry, medicine.anatomical_structure, Cell culture, Drug Resistance, Neoplasm, Cancer research, Molecular Medicine, Naphthoquinones, Protein Binding
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3
المؤلفون: Siddappa A. Patil, Gautam Achar, Srinivasa Budagumpi, Xuan-Ren Chen, Jan Grzegorz Małecki, Albert Lan, Szu-Hua Pan, C.R. Shahini
المصدر: Journal of Inorganic Biochemistry. 183:43-57
مصطلحات موضوعية: Steric effects, Staphylococcus aureus, Benzimidazole, Cell Survival, Population, Antineoplastic Agents, Microbial Sensitivity Tests, Crystal structure, Gram-Positive Bacteria, 010402 general chemistry, 01 natural sciences, Biochemistry, Inorganic Chemistry, chemistry.chemical_compound, Anti-Infective Agents, Coumarins, Cell Line, Tumor, Gram-Negative Bacteria, Escherichia coli, Humans, Molecule, education, Coordination geometry, education.field_of_study, Molecular Structure, 010405 organic chemistry, Chemistry, Combinatorial chemistry, Anti-Bacterial Agents, 0104 chemical sciences, A549 Cells, Intramolecular force, Benzimidazoles, Carbene
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4دورية أكاديمية
المؤلفون: Agnes Adom-Konadu, Ebenezer Bonyah, Albert Lanor Sackitey, Martin Anokye, Joshua Kiddy K. Asamoah
المصدر: Healthcare Analytics, Vol 3, Iss , Pp 100191- (2023)
مصطلحات موضوعية: Monkeypox, Newton polynomial interpolation, Simulation, Ulam–Hyers stability, Vaccination, Computer applications to medicine. Medical informatics, R858-859.7
وصف الملف: electronic resource
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5
المؤلفون: Frank Chu, Cheng Kai Chang, Nicholas Kao, Ryan Chiu, Mike Tsai, Daniel Chen, Sheng Ming Yang, Chi Liang Shih, Terence Huang, Albert Lan, J. Y. Chen, S. L. Chung
المصدر: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: 010302 applied physics, Engineering, business.industry, 020206 networking & telecommunications, 02 engineering and technology, 01 natural sciences, Die (integrated circuit), Small form factor, Form factor (design), System in package, Embedded system, visual_art, 0103 physical sciences, Electronic component, Package on package, 0202 electrical engineering, electronic engineering, information engineering, visual_art.visual_art_medium, Electronics, business, Wearable technology
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::09d0f227c6ea1bd4245b2c1323483d63
https://doi.org/10.1109/ectc.2017.46 -
6
المؤلفون: Kohan Lin, Mark Liao, Boxiang Fang, Albert Lan
المصدر: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: Power management, Interconnection, Engineering, business.industry, Electrical engineering, Substrate (printing), Die (integrated circuit), visual_art, Electronic component, visual_art.visual_art_medium, Wafer, Electronics, Radio frequency, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::5040d941a8161ee32cba3064361ac335
https://doi.org/10.1109/ectc.2017.109 -
7Assembly Challenges for 75x75mm Large Body FCBGA with Emerging High Thermal Interface Material (TIM)
المؤلفون: Steward Pan, Max Lu, Fletcher Tung, Albert Lan
المصدر: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: 010302 applied physics, Thermal copper pillar bump, Moore's law, Engineering, business.industry, Thermal resistance, media_common.quotation_subject, Electrical engineering, Thermal grease, Heat sink, 01 natural sciences, Electromigration, Engineering physics, Ball grid array, 0103 physical sciences, business, Flip chip, media_common
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::5027df178348db134c0aead7ee0059fb
https://doi.org/10.1109/ectc.2017.121 -
8دورية أكاديمية
المؤلفون: Rostyslav Lanevych, Albert Lanevych
المصدر: Фізичне виховання, спорт і культура здоров’я у сучасному суспільстві, Iss 4(60), Pp 66-70 (2022)
مصطلحات موضوعية: пляжний гандбол, національні збірні, юніори, спорт, чемпіонат, результати змагань, Sports medicine, RC1200-1245
وصف الملف: electronic resource
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9
المؤلفون: Vincent Huang, Edward Law, Raymond Kwok Cheung Tsang, Albert Lan, Fletcher Tung, Max Lu
المصدر: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: Thermal copper pillar bump, Engineering, Reliability (semiconductor), business.industry, Soldering, Electronic engineering, Solder paste, Substrate (printing), business, Layer (electronics), Automotive engineering, Die (integrated circuit), Flip chip
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::06d3df84f8f2250bdf43e95ba4706f41
https://doi.org/10.1109/ectc.2016.157 -
10
المؤلفون: Wh Lin, Arthur Ho, Jensen Tsai, Jerry Chang, Jason Wu, Albert Lan, Tom Tang, Joe Huang, Jerry Li
المصدر: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: 010302 applied physics, 0209 industrial biotechnology, Engineering, business.industry, Mechanical engineering, 02 engineering and technology, Structural engineering, Fixture, 01 natural sciences, Die (integrated circuit), Molding (decorative), 020901 industrial engineering & automation, Chip-scale package, 0103 physical sciences, Miniaturization, Wafer, Process window, Integrated circuit packaging, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::0f236ae33df623167f0eaa05ed322bc9
https://doi.org/10.1109/ectc.2016.51