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المؤلفون: Alice Guerrero, Pieter Bex, Andrew M. Jones, Arthur Southard, Daojie Dong, Alain Phommahaxay, Eric Beyne
المصدر: International Symposium on Microelectronics. 2021:000060-000066
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::aa03357fc3857d08886d0fcae9123d7f
https://doi.org/10.4071/1085-8024-2021.1.000060 -
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المؤلفون: Koen Kennes, Alain Phommahaxay, Alice Guerrero, Samuel Suhard, Pieter Bex, Steven Brems, Xiao Liu, Sebastian Tussing, Gerald Beyer, Eric Beyne
المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::58e9e10a5889e658df1c9be39f0df5a3
https://doi.org/10.1109/ectc51906.2022.00324 -
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المؤلفون: Dennis Bumueller, Eric Beyne, Sebastian Tussing, Alice Guerrero, Xiao Liu, Gerald Beyer, Samuel Suhard, Pieter Bex, Alain Phommahaxay, Koen Kennes
المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: Shock wave, Materials science, Yield (engineering), Laser ablation, business.product_category, business.industry, Laser, law.invention, law, Die (manufacturing), Wafer, Composite material, business, Layer (electronics), Thermal energy
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::c5e107108dceac22a45be0f8f251c9b4
https://doi.org/10.1109/ectc32696.2021.00334 -
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المؤلفون: Pieter Bex, Alain Phommahaxay, G. Beyer, Serena Iacovo, Thomas Schmidt, Samuel Suhard, Koen Kennes, Eric Beyne, Alice Guerrero, Olga Bauder, Xiao Liu
المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: Materials science, business.product_category, Carrier system, business.industry, Limiting, Laser assisted, Laser, law.invention, law, Compatibility (mechanics), Optoelectronics, Die (manufacturing), Wafer, business
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::1ce6dfb5ba9a8b5862216f3717a2a166
https://doi.org/10.1109/ectc32862.2020.00056 -
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المؤلفون: Andy Miller, Walter Spiess, John Slabbekoorn, Arnita Podpod, Inge Asselberghs, Stefan Lutter, Kim Yess, Erik Sleeckx, Koen Kennes, Luke Prenger, Alice Guerrero, Iuliana Radu, Sebastian Tussing, Steven Brems, Cedric Huyghebaert, Gerald Beyer, Alain Phommahaxay, Thomas Rapps, Kim Arnold, Eric Beyne
المصدر: 2019 International Wafer Level Packaging Conference (IWLPC).
مصطلحات موضوعية: Beyond CMOS, Semiconductor, Nanoelectronics, Computer science, Wafer bonding, business.industry, Hardware_INTEGRATEDCIRCUITS, Fan-out, Wafer, Substrate (printing), business, Engineering physics, Field (computer science)
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::ec6f8641c1e8c7e1ba580647f8ceb62c
https://doi.org/10.23919/iwlpc.2019.8914124 -
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المؤلفون: Alice Guerrero, Tom Cochet, Arnita Podpod, Hariharan Arumugam, Koen Kennes, Qi Wu, Kim Yess, Erick Sleeckx, Kim Arnold, Julien Bertheau, Andy Miller, Gerald Beyer, Eric Beyne, Alain Phommahaxay, Pieter Bex, Kenneth June Rebibis, Xiao Liu
المصدر: 2019 International Wafer Level Packaging Conference (IWLPC).
مصطلحات موضوعية: Interconnection, Materials science, Silicon, Wafer bonding, business.industry, Orders of magnitude (temperature), chemistry.chemical_element, Die (integrated circuit), chemistry, Distortion, Optoelectronics, Wafer, business, Flip chip
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::a414a95c86ac2e4f1be7eb284d750225
https://doi.org/10.23919/iwlpc.2019.8914144 -
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المؤلفون: Erik Sleeckx, Andy Miller, Pieter Bex, Arnita Podpod, Alain Phommahaxay, Alice Guerrero, John Slabbekoorn, Kim Yess, Abdellah Salahoueldhadj, Kim Arnold, Eric Beyne, G. Beyer, Julien Bertheau
المصدر: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: Interconnection, Wafer thinning, Wafer bonding, Computer science, business.industry, Limit (music), Hardware_INTEGRATEDCIRCUITS, Electrical engineering, Fan-out, High density, business, Flip chip
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::b6c787fc0dbf692ab0910773a997edda
https://doi.org/10.1109/ectc.2019.00059 -
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المؤلفون: Alain Phommahaxay, Dongshun Bai, Arnita Podpod, Erik Sleeckx, John Slabbekoorn, Alice Guerrero, Gerald Beyer, Kim Arnold, Eric Beyne
المصدر: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: Materials science, Wafer bonding, Hardware_INTEGRATEDCIRCUITS, High density, Fan-out, Wafer, Hardware_PERFORMANCEANDRELIABILITY, Substrate (printing), Engineering physics, First generation
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::9622450c855e3636627e39110e843fa2
https://doi.org/10.1109/ectc.2018.00151 -
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المؤلفون: Alice Guerrero, Goedele Potoms, Anne Jourdain, Kim Yess, Alain Phommahaxay, Erik Sleeckx, Gerald Beyer, Dongshun Bai, Kim Arnold, Eric Beyne, Greet Verbinnen
المصدر: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: Materials science, Process (engineering), Transfer (computing), Nanotechnology, Wafer, Substrate (printing)
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::f52c5f97fa4c4b8cd2d04f9963c29dd2
https://doi.org/10.1109/ectc.2017.55 -
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المؤلفون: Walter Spiess, Erik Sleeckx, Goedele Potoms, Alain Phommahaxay, Stefan Lutter, Greet Verbinnen, Kim Yess, Thomas Rapps, Alice Guerrero, Gerald Beyer, Dongshun Bai, Xiao Liu, Kim Arnold, Eric Beyne, Tim Griesbach
المصدر: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).
مصطلحات موضوعية: Stress (mechanics), Die preparation, Materials science, CMOS, Anodic bonding, law, Wafer, Substrate (printing), Composite material, Laser, Engineering physics, law.invention
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::3050b30af8086c577894c4a0f1a55dd8
https://doi.org/10.1109/ectc.2016.80