المؤلفون: Sylvain Joblot, Alisee Taluy, R. Franiatte, A. Jouve, S. Cheramy, J. Bertheau, N. Sillon, Alain Sylvestre, P. Ancey, Alexis Farcy

المساهمون: STMicroelectronics [Crolles] (ST-CROLLES), Laboratoire de Génie Electrique de Grenoble (G2ELab), Université Joseph Fourier - Grenoble 1 (UJF)-Institut polytechnique de Grenoble - Grenoble Institute of Technology (Grenoble INP )-Institut Polytechnique de Grenoble - Grenoble Institute of Technology-Centre National de la Recherche Scientifique (CNRS), Commissariat à l'énergie atomique et aux énergies alternatives - Laboratoire d'Electronique et de Technologie de l'Information (CEA-LETI), Direction de Recherche Technologique (CEA) (DRT (CEA)), Commissariat à l'énergie atomique et aux énergies alternatives (CEA)-Commissariat à l'énergie atomique et aux énergies alternatives (CEA)

المصدر: Electronic components and technology conference
Electronic components and technology conference, May 2013, Las Vegas, United States

مصطلحات موضوعية: Interconnection, Yield (engineering), Materials science, [SPI.NRJ]Engineering Sciences [physics]/Electric power, 02 engineering and technology, 021001 nanoscience & nanotechnology, Residual, 01 natural sciences, 010305 fluids & plasmas, Soldering, 0103 physical sciences, Electronic engineering, Wafer, Composite material, 0210 nano-technology, Joint (geology), Wafer-level packaging, Flip chip, ComputingMilieux_MISCELLANEOUS

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::ec7dffb27deb9b1b0ba0a692a57f3b87
https://hal.archives-ouvertes.fr/hal-00846919

المؤلفون: Severine Cheramy, Emilienne Dezandre, G. Garnier, Alisee Taluy, Sandrine Lhostis, Alexis Farcy, A. Jouve, Nicolas Sillon, Alain Sylvestre

المصدر: 2011 IEEE 13th Electronics Packaging Technology Conference.

مصطلحات موضوعية: Void (astronomy), Materials science, Capillary action, Moisture storage, Thermal, Wafer, Temperature cycling, Composite material, Wafer-level packaging, Flip chip

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::c063a6a49d24f48ceadf2e69f4294a8d
https://doi.org/10.1109/eptc.2011.6184400