يعرض 1 - 10 نتائج من 2,700 نتيجة بحث عن '"Allison, T."', وقت الاستعلام: 0.89s تنقيح النتائج
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    دورية أكاديمية

    المؤلفون: Judy Reaven (ORCID 0000-0003-3031-9517), Katherine Pickard (ORCID 0000-0002-3783-9753), Allison T. Meyer, Lisa Hayutin, Caitlin Middleton, Nuri M. Reyes, Tanea Tanda, Aubyn Stahmer (ORCID 0000-0002-1596-9848), Audrey Blakeley-Smith, Richard E. Boles

    المصدر: Autism: The International Journal of Research and Practice. 2024 28(2):484-497.

    Peer Reviewed: Y

    Page Count: 14

    Sponsoring Agency: Health Resources and Services Administration (HRSA) (DHHS)
    Administration on Intellectual and Developmental Disabilities (AIDD) (DHHS/ACL)

  2. 2
    مؤتمر

    المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :1465-1471 May, 2022

    Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

  3. 3
    مؤتمر

    المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :1153-1157 May, 2022

    Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

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  6. 6
    مؤتمر

    المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :2334-2339 Jun, 2021

    Relation: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

  7. 7
    دورية أكاديمية

    المصدر: Journal of Autism and Developmental Disorders. Feb 2023 53(2):569-579.

    Peer Reviewed: Y

    Page Count: 11

    Sponsoring Agency: National Institutes of Health (NIH) (DHHS)
    Health Resources and Services Administration (HRSA) (DHHS)
    Administration on Intellectual and Developmental Disabilities (AIDD) (DHHS/ACL)

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    مؤتمر

    المصدر: 2020 International Wafer Level Packaging Conference (IWLPC) Wafer Level Packaging Conference (IWLPC), 2020 International. :1-8 Oct, 2020

    Relation: 2020 International Wafer Level Packaging Conference (IWLPC)

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    مؤتمر

    المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :723-728 Jun, 2020

    Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)