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1مؤتمر
المؤلفون: Alves Braganca, Wagno, Eom, Yong-Sung, Son, Jihye, Jang, Keon-Soo, Bae, Hyun-Cheol, Moon, Seok Hwan, Choi, Kwang-Seong
المصدر: 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2017 IEEE 19th. :1-8 Dec, 2017
Relation: 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC)
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2دورية أكاديمية
المؤلفون: Alves Braganca, Wagno, Eom, Yong‐Sung, Jang, Keon‐Soo, Moon, Seok Hwan, Bae, Hyun‐Cheol, Choi, Kwang‐Seong
المصدر: ETRI Journal; Jun2019, Vol. 41 Issue 3, p396-407, 12p
مصطلحات موضوعية: SOLDER joints, THROUGH-silicon via, INTERMETALLIC compounds, LASER beams, PASTE