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المصدر: Advances in Technology Transfer Through IoT and IT Solutions ISBN: 9783031251771
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::390bac7d1c7f4a3afbd80fb8b5c0010d
https://doi.org/10.1007/978-3-031-25178-8_1 -
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المؤلفون: N. Pragadish, Elango Natarajan, M. Selvam, Amares Singh, N. Saravanakumar
المصدر: Materials, Design and Manufacturing for Sustainable Environment ISBN: 9789811930522
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::d88b6fe7376a762995f43580a094c718
https://doi.org/10.1007/978-981-19-3053-9_40 -
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المصدر: Materials, Design and Manufacturing for Sustainable Environment ISBN: 9789811930522
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::b5bc571ec10c6313b4b74e074f650982
https://doi.org/10.1007/978-981-19-3053-9_3 -
4دورية أكاديمية
المؤلفون: Ervina Efzan Mhd Noor, Amares Singh
المصدر: Soldering & Surface Mount Technology, 2014, Vol. 26, Issue 3, pp. 147-161.
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المؤلفون: Amares Singh, Kuan Seng How, Rajkumar Durairaj
المصدر: Journal of Advanced Research in Fluid Mechanics and Thermal Sciences. 77:69-87
مصطلحات موضوعية: Fluid Flow and Transfer Processes, Differential scanning calorimetry, Materials science, chemistry, Molybdenum, Soldering, Metallurgy, Nanoparticle, chemistry.chemical_element, Lamellar structure, Dispersion (chemistry), Microstructure, Indentation hardness
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::0efbb3adf30886da7fe9d5070316007e
https://doi.org/10.37934/arfmts.77.1.6987 -
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المؤلفون: Shamini Janasekaran, Zhou Lei, Tok Rui Jun, Lee Jia Yunn, Amares Singh
المصدر: Advanced Maritime Technologies and Applications ISBN: 9783030899912
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::a87ddca05770f860654c5d1d9a7f514b
https://doi.org/10.1007/978-3-030-89992-9_1 -
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المؤلفون: Amares Singh, Rajkumar Durairaj, K Ganesh Kumar, Seng How Kuan
المصدر: IOP Conference Series: Materials Science and Engineering. 1225:012029
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المؤلفون: Rajkumar Durairaj, Amares Singh
المصدر: IOP Conference Series: Materials Science and Engineering. 834:012075
مصطلحات موضوعية: Materials science, Shear strength, Nanoparticle, Composite material, Microstructure
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المؤلفون: Amares Singh, Ervina Efzan Mhd Noor
المصدر: Soldering & Surface Mount Technology. 26:147-161
مصطلحات موضوعية: Materials science, Melting temperature, Metallurgy, Electronic packaging, chemistry.chemical_element, Nanoparticle, Condensed Matter Physics, Microstructure, chemistry, Soldering, General Materials Science, Wetting, Electrical and Electronic Engineering, Tin, Solder alloy
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المؤلفون: Amares Singh, Yap Tze Chuan, Ervina Efzan Mhd Noor
المصدر: Soldering & Surface Mount Technology. 25:229-241
مصطلحات موضوعية: Reliability (semiconductor), Materials science, Melting temperature, Soldering, Metallurgy, Electronic packaging, Shear strength, Nanoparticle, General Materials Science, Electrical and Electronic Engineering, Condensed Matter Physics, Microstructure, Solder alloy