المؤلفون: Xue, Yuxiang, Li, Hui, Wu, Yingzhe, Dong, Minghai, Wang, Lisheng, Zhang, Hengbin, Liu, Xi

المصدر: 2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa) Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa), 2024 IEEE Joint International Symposium on. :731-734 May, 2024

Relation: 2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa)

المؤلفون: Zhang, Hengbin, Li, Hui, Wu, Yingzhe, Wang, Lisheng, Xue, Yuxiang

المصدر: 2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia) Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia), 2024 IEEE 10th International. :933-939 May, 2024

Relation: 2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia)

المؤلفون: Xue, Yuxiang, Li, Hui, Wu, Yingzhe, Wang, Lisheng, Zhang, Hengbin

المصدر: 2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia) Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia), 2024 IEEE 10th International. :926-932 May, 2024

Relation: 2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia)

المؤلفون: Wang, Hengbin, Xia, Dan, Yang, Zhanchao, Du, Xinrun, Zhao, Peichen, Zheng, Xiaolong, Liu, Liang, Ma, Huadong

المصدر: 2023 IEEE International Conferences on Internet of Things (iThings) and IEEE Green Computing & Communications (GreenCom) and IEEE Cyber, Physical & Social Computing (CPSCom) and IEEE Smart Data (SmartData) and IEEE Congress on Cybermatics (Cybermatics) ITHINGS-GREENCOM-CPSCOM-SMARTDATA-CYBERMATICS Internet of Things (iThings) and IEEE Green Computing & Communications (GreenCom) and IEEE Cyber, Physical & Social Computing (CPSCom) and IEEE Smart Data (SmartData) and IEEE Congress on Cybermatics (Cybermatics), 2023 IEEE International Conferences. :708-715 Dec, 2023

Relation: 2023 IEEE International Conferences on Internet of Things (iThings) and IEEE Green Computing & Communications (GreenCom) and IEEE Cyber, Physical & Social Computing (CPSCom) and IEEE Smart Data (SmartData) and IEEE Congress on Cybermatics (Cybermatics)

المؤلفون: Chen, Jindong^{Aff1, Aff2, IDs10924024033341_cor1}, Qiu, Hengbin, Djouonkep, Lesly Dasilva Wandji^{Aff1, Aff2}, Lv, Junxian^{Aff1, Aff2}, Xie, Binqiang^{Aff1, Aff2, IDs10924024033341_cor5}

المصدر: Journal of Polymers and the Environment: formerly: `Journal of Environmental Polymer Degradation'. :1-12

المؤلفون: Liu, Yuanxing, Zhang, Wei-Nan, Chen, Yifan, Zhang, Yuchi, Bai, Haopeng, Feng, Fan, Cui, Hengbin, Li, Yongbin, Che, Wanxiang

مصطلحات موضوعية: Computer Science - Computation and Language, Computer Science - Information Retrieval

URL الوصول: http://arxiv.org/abs/2310.14626

المؤلفون: Yao, HuiMing, Du, XinRun, Wang, HengBin, Gao, Song, Pang, YaChen, Zheng, HaiRong, Gong, HuiWen, Li, Yi, Xu, JianChun^{Aff1, IDs1143102325760_cor9}, Zhang, JianHua^{Aff3, IDs1143102325760_cor10}, Bi, Ke^{Aff1, IDs1143102325760_cor11}

المصدر: Science China Technological Sciences. 67(4):1133-1138

المؤلفون: Liu, Yuanxing, Zhang, Weinan, Dong, Baohua, Fan, Yan, Wang, Hang, Feng, Fan, Chen, Yifan, Zhuang, Ziyu, Cui, Hengbin, Li, Yongbin, Che, Wanxiang

مصطلحات موضوعية: Computer Science - Information Retrieval, Computer Science - Artificial Intelligence

URL الوصول: http://arxiv.org/abs/2305.04774

المؤلفون: Xie, Jun, Zhang, Hengbin^{Aff2, IDs00340024082456_cor2}

المصدر: Applied Physics B: Lasers and Optics. 130(7)

المؤلفون: He, Linqing, Cao, Jiarui, Xie, Xiaolin, Zhang, Yayun, Zhang, Xue, Wang, Hengbin, Ma, Lingman^{Aff1, IDs0070502406053z_cor7}

المصدر: Archives of Virology: Official Journal of the Virology Division of the International Union of Microbiological Societies. 169(6)