يعرض 1 - 10 نتائج من 134 نتيجة بحث عن '"An-Yao Hsiao"', وقت الاستعلام: 1.05s تنقيح النتائج
  1. 1
    مؤتمر
    Polymer Based Dual Damascene Process for Fine Pitch RDL Advanced Packaging

    المؤلفون: Hsiang-Yao, Hsiao, Ley, Ryan, Suo, Peng, Bum, Andy Yong Chang, Quon, Roger

    المصدر: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :391-395 Dec, 2023

    Relation: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)

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  2. 2
    مؤتمر
    Development of Large RDL Interposer Package using RDL-first FOWLP Process

    المؤلفون: Ho, Soon Wee, Boon Soh, Siew, Lau, Boon Long, Hsiang-Yao, Hsiao, Rao, Vempati Srinivasa

    المصدر: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :29-34 Dec, 2023

    Relation: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)

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  3. 3
    مؤتمر
    Assembly Challenges and Approaches for 2.5D Chiplet Based System

    المؤلفون: Lim, Sharon PeiSiang, Rotaru, Mihai D., Seit, Wenwei, Yao, Hsiao Hsiang

    المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :132-138 May, 2023

    Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

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  4. 4
    مؤتمر
    Wafer Level Package with Polymer Sealed Air Cavity

    المؤلفون: Ho, Soon Wee, Siew Boon, Serine Soh, Long, Lau Boon, Hsiang-Yao, Hsiao

    المصدر: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2022 IEEE 24th. :598-602 Dec, 2022

    Relation: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)

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  5. 5
    مؤتمر
    Double Mold Fan-Out Wafer Level Packaging for AiP Applications

    المؤلفون: Long, Lau Boon, Ho, David, Guan, Lim Teck, Mei, Sun, Yao, Hsiao Hsiang

    المصدر: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2022 IEEE 24th. :01-06 Dec, 2022

    Relation: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)

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  6. 6
    مؤتمر
    Process Development of Via Formation by Laser Drilling on Insulating Resin

    المؤلفون: Cereno, Daniel Ismael, Choong, Chong Ser, Hsiang-Yao, Hsiao

    المصدر: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2022 IEEE 24th. :401-404 Dec, 2022

    Relation: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)

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  7. 7
    مؤتمر
    Process Development of Fan-Out with Multi-layer RDL for Chiplets Packaging

    المؤلفون: Hsiang-Yao, Hsiao, Soon Wee, David Ho, PS, Sharon Lim

    المصدر: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2022 IEEE 24th. :89-93 Dec, 2022

    Relation: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)

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  8. 8
    مؤتمر
    Development of Two-Tier FO-WLP AiPs for Automotive Radar Application

    المؤلفون: Ho, Soon Wee, Hsiang-Yao, Hsiao, Long, Lau Boon, Siang, Sharon Lim Pei, Guan, Lim Teck, Chong, Chai Tai

    المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :1376-1383 May, 2022

    Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

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  9. 9
    مؤتمر
    Fabrication Process Flow of Antenna-in-Package Fan-out Wafer Level Packaging

    المؤلفون: Long, Lau Boon, Ho, David, Guan, Lim Teck, Yao, Hsiao Hsiang, Siang, Lim Pei, Jaafar, Norhanani

    المصدر: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2021 IEEE 23rd. :226-230 Dec, 2021

    Relation: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)

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  10. 10
    مؤتمر
    Double Mold Antenna in Package for 77 GHz Automotive Radar

    المؤلفون: Ho, Soon Wee, Boon, Soh Siew, Long, Lau Boon, Hsiang-Yao, Hsiao, Choong, Chong Ser, Pei Siang, Sharon Lim, Guan, Lim Teck, Chong, Chai Tai

    المصدر: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2020 IEEE 22nd. :257-261 Dec, 2020

    Relation: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)

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