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1
المؤلفون: Ander Hsieh, Mike Huang, Johnny Ch Chen, Michael Yeh
المصدر: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::8d2e0fac8721615eb3fef3e99fe01fa7
https://doi.org/10.1109/impact56280.2022.9966671 -
2
المؤلفون: Jimmy Yang, Cheng Yu Chen, Jay Cy Huang, Jojo Tsai, Vincent Lee, J. L. Ku, Ander Hsieh, K. C. Li
المصدر: 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference.
مصطلحات موضوعية: Surface-mount technology, Materials science, Stencil printing, Aperture, Laser cutting, Soldering, Ball grid array, Metallurgy, Solder paste, Composite material, Stencil
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::923b2af3d7b1a2df4be4452468325cab
https://doi.org/10.1109/impact.2010.5699642 -
3
المؤلفون: K. C. Li, Mike Huang, Jay Cy Huang, Jimmy Yang, Ander Hsieh, J. L. Ku
المصدر: 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference.
مصطلحات موضوعية: Materials science, Optical microscope, Scanning electron microscope, law, Soldering, Metallurgy, Fracture (geology), Surface finish, Microstructure, Joint (geology), Surface finishing, law.invention
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::441d73a2946400dc3640d2a2f8505853
https://doi.org/10.1109/impact.2010.5699643