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1دورية أكاديمية
المؤلفون: SHU-MING CHANG, Chelsea Swank, Andrew Kummel, James F. Buckwalter
المصدر: IEEE Journal of Microwaves, Vol 4, Iss 1, Pp 147-157 (2024)
مصطلحات موضوعية: Millimeter-wave, D-band, dielectric characterization, free-space focused beam, time-domain gating, diamond composites, Telecommunication, TK5101-6720, Electric apparatus and materials. Electric circuits. Electric networks, TK452-454.4
وصف الملف: electronic resource
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2دورية أكاديمية
المؤلفون: Haichang Lu, Andrew Kummel, John Robertson
المصدر: APL Materials, Vol 6, Iss 6, Pp 066104-066104-9 (2018)
مصطلحات موضوعية: Biotechnology, TP248.13-248.65, Physics, QC1-999
وصف الملف: electronic resource
Relation: https://doaj.org/toc/2166-532X
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3
المؤلفون: Tony Reid, Andrew Kummel, Scott Caroen, Jaimin Shah, Bryan Oronsky, Christopher Larson
المصدر: Cancer Research. 83:P3-07
مصطلحات موضوعية: Cancer Research, Oncology
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::df3e79b12c07929ffbc84a2c83e82fa7
https://doi.org/10.1158/1538-7445.sabcs22-p3-07-20 -
4دورية أكاديمية
لا يتم عرض هذه النتيجة على الضيوف.
تسجيل الدخول للوصول الكامل. -
5
المؤلفون: Kisung Chae, Sarah F. Lombardo, Nujhat Tasneem, Mengkun Tian, Harish Kumarasubramanian, Jae Hur, Winston Chern, Shimeng Yu, Claudia Richter, Patrick D. Lomenzo, Michael Hoffmann, Uwe Schroeder, Dina Triyoso, Steven Consiglio, Kanda Tapily, Robert Clark, Gert Leusink, Nazanin Bassiri-Gharb, Prab Bandaru, Jayakanth Ravichandran, Andrew Kummel, Kyeongjae Cho, Josh Kacher, Asif Islam Khan
المصدر: ACS Applied Materials & Interfaces. 14:36771-36780
مصطلحات موضوعية: General Materials Science
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6
المؤلفون: Qing Lin, Gregory Pitner, Carlo Gilardi, Sheng-Kai Su, Zichen Zhang, Edward Chen, Prabhakar Bandaru, Andrew Kummel, Han Wang, Matthias Passlack, Subhasish Mitra, H.-S. Philip Wong
المصدر: IEEE Electron Device Letters. 43:490-493
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7
المؤلفون: Sou-Chi Chang, Kisung Chae, Mihaela I. Popovici, Chia-Ching Lin, Saima Siddiqui, I-Cheng Tung, Jasper Bizindavyi, Bernal Granados Alpizar, Nazila Haratipour, Matthew Metz, Jack Kavalieros, Gouri S. Kar, Andrew Kummel, Kyeongjae Cho, Uygar E. Avci
المصدر: 2022 International Electron Devices Meeting (IEDM).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::07937a3b38d874c2de7ac79b087a3ba5
https://doi.org/10.1109/iedm45625.2022.10019540 -
8
المؤلفون: Michael Breeden, Victor Wang, Ravindra Kanjolia, Mansour Moinpour, Jacob Woodruff, Harsono Simka, Andrew Kummel
المصدر: 2022 IEEE International Interconnect Technology Conference (IITC).
URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::f772c1a4d01baee71eeba80298d190b7
https://doi.org/10.1109/iitc52079.2022.9881300 -
9دورية أكاديمية
المؤلفون: Huang, James, Cho, Yunil, Wang, Victor, Zhang, Zichen, Mu, Jing, Yadav, Ajay, Wong, Keith, Nemani, Srinivas, Yieh, Ellie, Andrew, Kummel
المصدر: ACS Applied Materials & Interfaces; 5/31/2023, Vol. 15 Issue 21, p26128-26137, 10p
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10دورية
المؤلفون: Huang, James, Cho, Yunil, Wang, Victor, Zhang, Zichen, Mu, Jing, Yadav, Ajay, Wong, Keith, Nemani, Srinivas, Yieh, Ellie, Andrew, Kummel
المصدر: ACS Applied Materials & Interfaces; May 2023, Vol. 15 Issue: 21 p26128-26137, 10p