المؤلفون: Lin, T.-H., Menezes, A. S., Andros, F., McBride, D. G., Lu, S., Sammakia, B.

المصدر: IEEE Transactions on Electronics Packaging Manufacturing IEEE Trans. Electron. Packag. Manufact. Electronics Packaging Manufacturing, IEEE Transactions on. 30(3):206-212 Jul, 2007

المؤلفون: Choubey, A., Andros, F., Sammakia, B.G.

المصدر: IEEE Transactions on Components and Packaging Technologies IEEE Trans. Comp. Packag. Technol. Components and Packaging Technologies, IEEE Transactions on. 28(2):303-310 Jun, 2005

المؤلفون: Garimella, S.V., Joshi, Y.K., Bar-Cohen, A., Mahajan, R., Toh, K.C., Carey, V.P., Baelmans, M., Lohan, J., Sammakia, B., Andros, F.

المصدر: IEEE Transactions on Components and Packaging Technologies IEEE Trans. Comp. Packag. Technol. Components and Packaging Technologies, IEEE Transactions on. 25(4):569-575 Dec, 2002

المؤلفون: Chaparala, S., Andros, F., Infantolino, W., Sammakia, B.

المصدر: 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems Thermal and Thermomechanical Phenomena in Electronic Systems, 2008. ITHERM 2008. 11th Intersociety Conference on. :720-725 May, 2008

Relation: 2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (I-THERM)

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المؤلفون: Choubey, A., Andros, F., Sammakia, B.

المصدر: 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) Electronic components and technology Electronic Components and Technology Conference, 2004. Proceedings. 54th. 2:2020-2026 Vol.2 2004

Relation: 2004 Proceedings. 54th Electronic Components and Technology Conference

المؤلفون: Bahadur, R., Sammakia, B., Andros, F.

المصدر: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543) Thermal and thermomechanical phenomena in electronic systems Thermal and Thermomechanical Phenomena in Electronic Systems, 2004. ITHERM '04. The Ninth Intersociety Conference on. 1:381-388 Vol.1 2004

Relation: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems

المؤلفون: Garimella, S V, Joshi, Yogendra K, Bar-Cohen, Avram, Mahajan, Ravi, Toh, K. C., Carey, V. P., Baelmans, M., Lohan, J., Sammakia, B., Andros, F.

المصدر: CTRC Research Publications

وصف الملف: application/pdf

URL الوصول: https://explore.openaire.eu/search/publication?articleId=od_______540::0d9f2bc139ac894a05f2528dc97b005a
http://docs.lib.purdue.edu/coolingpubs/24

المؤلفون: Ta-Hsuan Lin, Andros, F., Lu, S., Sammakia, B.

المصدر: 2008 10th Electronics Packaging Technology Conference; 2008, p1316-1320, 5p

المؤلفون: Ta-Hsuan Lin, Menezes, A.S., Andros, F., McBride, D.G., Lu, S., Sammakia, B.

المصدر: IEEE Transactions on Electronics Packaging Manufacturing; Jul2007, Vol. 30 Issue 3, p206-212, 7p