المؤلفون: Peng Xue, Amir Sajjad Bahman, Francesco Iannuzzo, Helene Conseil Gudla, Anish Rao Lakkaraju, Rajan Ambat

المصدر: Xue, P, Bahman, A S, Iannuzzo, F, Gudla, H C, Lakkaraju, A R & Ambat, R 2022, ' Prediction of the electrochemical migration induced failure on power PCBs under humidity condition — A case study ', Microelectronics Reliability, vol. 139, 114796 . https://doi.org/10.1016/j.microrel.2022.114796

مصطلحات موضوعية: Printed circuit boards, Electrochemical migration, Humidity, Numerical simulation, Electrical and Electronic Engineering, Safety, Risk, Reliability and Quality, Condensed Matter Physics, Atomic and Molecular Physics, and Optics, Surfaces, Coatings and Films, Electronic, Optical and Magnetic Materials

وصف الملف: application/pdf

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::9eb58182fb4ebbbb9c091f14fc4e9a31
https://vbn.aau.dk/da/publications/75e2e10c-bccb-4316-83b7-97f44881aa80

المؤلفون: Anish Rao Lakkaraju, Helene Conseil-Gudla, Frantisek Steiner, Rajan Ambat

المصدر: Technical University of Denmark Orbit
Lakkaraju, A R, Conseil-Gudla, H, Steiner, F & Ambat, R 2021, ' Solder mask surface properties and related PCBA failure due to build-up of water layer ', EUROCORR 2021, Budapest, Hungary, 20/09/2021-24/09/2021 .

مصطلحات موضوعية: Surface roughness, Water layer formation, Temperature, Impedance, Humidity, Printed circuit board laminate, Solder mask

وصف الملف: application/pdf

URL الوصول: https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::d6d3f0b17466ca43d3e25ad3ecdfabbb
https://orbit.dtu.dk/en/publications/08e4ad6b-378d-4e92-8340-86786075bee8