يعرض 1 - 10 نتائج من 35 نتيجة بحث عن '"Aoki, Toyohiro"', وقت الاستعلام: 0.85s تنقيح النتائج
  1. 1
    مؤتمر
    Volume-controllable Solder Bumping Technology to Package Substrate Using Injection Molded Solder for Fine-pitch Flip Chip

    المؤلفون: Aoki, Toyohiro, Sakuma, Katsuyuki, Mori, Hiroyuki, Nakamura, Koki, Hisada, Takashi

    المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :585-589 May, 2023

    Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

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  2. 2
    مؤتمر
    Heterogeneous Integration on Organic Interposer Substrate with fine-pitch RDL and 40 micron pitch Micro-bumps

    المؤلفون: Sakuma, Katsuyuki, Bonilla, Griselda, McHerron, Dale, Aoki, Toyohiro, Kastberg, Russell, Pomerantz, Glenn, Bunt, Jay, Wassick, Tom

    المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :872-877 May, 2023

    Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

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  3. 3
    مؤتمر
    Flip Chip Joining with Injection Molded Solder Technology

    المؤلفون: Hisada, Takashi, Aoki, Toyohiro

    المصدر: 2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) Electron Devices Technology & Manufacturing Conference (EDTM), 2023 7th IEEE. :1-3 Mar, 2023

    Relation: 2023 7th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)

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  4. 4
    مؤتمر
    Analysis of process dependent mechanical properties of sintered copper nanoparticle pillars for the plating-free bumping by finite element method

    المؤلفون: Kohara, Sayuri, Aoki, Toyohiro, Marushima, Chinami, Taylor, Christine, Sueoka, Kuniaki, Hisada, Takashi

    المصدر: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2022 21st IEEE Intersociety Conference on. :1-8 May, 2022

    Relation: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)

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  5. 5
    مؤتمر
    Solder and Organic Adhesive Hybrid Bonding Technology with Non-strip Type Photosensitive Resin and Injection Molded Solder (IMS)

    المؤلفون: Matsumoto, Keiji, Watanabe, Takahito, Miyazawa, Risa, Aoki, Toyohiro, Hisada, Takashi, Nakamura, Yuzo, Kayaba, Yasuhisa, Kamada, Jun, Kohmura, Kazuo

    المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :340-346 May, 2022

    Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

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  6. 6
    مؤتمر
    Dimensional Parameters Controlling Capillary Underfill Flow for Void-Free Encapsulation of a Direct Bonded Heterogeneous Integration (DBHi) Si-bridge Package

    المؤلفون: Marushima, Chinami, Aoki, Toyohiro, Nakamura, Koki, Miyazawa, Risa, Horibe, Akihiro, de Sousa, Isabel, Sikka, Kamal, Hisada, Takashi

    المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :586-590 May, 2022

    Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

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  7. 7
    مؤتمر
    Surface Silicon Bridge Direct Bonded Heterogeneous Integration (s-DBHi)

    المؤلفون: Sikka, Kamal, Sousa, Isabel De, Jain, Aakrati, Marushima, Chinami, Aoki, Toyohiro, Kohara, Sayuri, Mori, Hiroyuki, Hisada, Takashi

    المصدر: 2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) Electron Devices Technology & Manufacturing Conference (EDTM), 2022 6th IEEE. :145-147 Mar, 2022

    Relation: 2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)

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  8. 8
    مؤتمر
    CFD Simulation Analysis and Experimental Study of Capillary Underfill Flow in Heterogeneous Integration

    المؤلفون: Miyazawa, Risa, Marushima, Chinami, Aoki, Toyohiro, Horibe, Akihiro, Hisada, Takashi

    المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :1050-1056 Jun, 2021

    Relation: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

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  9. 9
    مؤتمر
    Thermomechanical Analysis on Stress Mitigation of FCPBGA with Low Melting Temperature Solder and Low Elastic Modulus Cu Pillar

    المؤلفون: Hisada, Takashi, Kohara, Sayuri, Marushima, Chinami, Aoki, Toyohiro

    المصدر: 2022 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2022 International Conference on. :207-208 May, 2022

    Relation: 2022 International Conference on Electronics Packaging (ICEP)

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  10. 10
    مؤتمر
    Plating-free Bumping by Cu Nanopaste and Injection Molded Solder (IMS) for Fine Pitch Flip Chip Joining

    المؤلفون: Aoki, Toyohiro, Nakamura, Eiji, Kohara, Sayuri, Marushima, Chinami, Sueoka, Kuniaki, Hisada, Takashi, Yamaguchi, Ryota, Sekine, Nobuhiro, Yatsugi, Kenichi, Yada, Makoto

    المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :742-748 Jun, 2020

    Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

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