يعرض 1 - 10 نتائج من 259 نتيجة بحث عن '"Aoyagi, Masahiro"', وقت الاستعلام: 0.90s تنقيح النتائج
  1. 1
    مؤتمر
    FPGA Emulation of Through-Silicon-Via (TSV) Dataflow Network for 3D Standard Chip Stacking System

    المؤلفون: Ohkawa, Takeshi, Aoyagi, Masahiro

    المصدر: 2023 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS) Low-Power and High-Speed Chips (COOL CHIPS), 2023 IEEE Symposium in. :1-3 Apr, 2023

    Relation: 2023 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS)

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  2. 2
    مؤتمر
    Thermal Stress Comparison of Annular-Trench-Isolated (ATI) TSV with Cu and Solder Core

    المؤلفون: Feng, Wei, Watanabe, Naoya, Shimamoto, Haruo, Aoyagi, Masahiro, Kikuchi, Katsuya

    المصدر: 2019 International 3D Systems Integration Conference (3DIC) 3D Systems Integration Conference (3DIC), 2019 International. :1-4 Oct, 2019

    Relation: 2019 International 3D Systems Integration Conference (3DIC)

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  3. 3
    مؤتمر
    Electrostatic Shield TSVs to Suppress Coupling Among Stacked ICs

    المؤلفون: Araga, Yuuki, Katsuya, Kikuchi, Aoyagi, Masahiro

    المصدر: 2019 International 3D Systems Integration Conference (3DIC) 3D Systems Integration Conference (3DIC), 2019 International. :1-3 Oct, 2019

    Relation: 2019 International 3D Systems Integration Conference (3DIC)

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  4. 4
    مؤتمر
    Process evaluation of pyramidal and cone-shaped nanoparticle deposition (NPD) bumps using a thermally resistant resist

    المؤلفون: Lim, Ying Ying, Hashino, Masara, Nakagawa, Hiroshi, Aoyagi, Masahiro, Kikuchi, Katsuya

    المصدر: 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), 2018 International Conference on. :136-140 Apr, 2018

    Relation: 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)

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  5. 5
    مؤتمر
    Designing Efficient Parallel Processing in 3D Standard-Chip Stacking System with Standard Bus

    المؤلفون: Ohkawa, Takeshi, Ootsu, Kanemitsu, Yokota, Takashi, Kikuchi, Katsuya, Aoyagi, Masahiro

    المصدر: 2017 IEEE 11th International Symposium on Embedded Multicore/Many-core Systems-on-Chip (MCSoC) MCSOC Embedded Multicore/Many-core Systems-on-Chip (MCSoC), 2017 IEEE 11th International Symposium on. :128-135 Sep, 2017

    Relation: 2017 IEEE 11th International Symposium on Embedded Multicore/Many-core Systems-on-Chip (MCSoC)

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  6. 6
    مؤتمر
    Coplanar differential capacitively coupled contactless conductivity detection (CD-C4D) sensor for micro object inside fluidic flow recognization

    المؤلفون: Thuy, Ha Tran Thi, Quang, Loc Do, Dau, Van Thanh, Kim, Ngan Nguyen Thi, Le Van, Chieu, Aoyagi, Masahiro, Kikuchi, Katsuya, Bui, Tung Thanh

    المصدر: 2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS) Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), 2017 19th International Conference on. :1124-1127 Jun, 2017

    Relation: 2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS)

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  7. 7
    مؤتمر
    Metal Contamination Evaluation of Via-Last Cu TSV Process Using Notchless Si Etching and Wet Cleaning of the First Metal Layer

    المؤلفون: Watanabe, Naoya, Kikuchi, Hidekazu, Yanagisawa, Azusa, Shimamoto, Haruo, Kikuchi, Katsuya, Aoyagi, Masahiro, Nakamura, Akio

    المصدر: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th. :655-660 May, 2017

    Relation: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)

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  8. 8
    مؤتمر
    Wet cleaning process for high-yield via-last TSV formation

    المؤلفون: Watanabe, Naoya, Shimamoto, Haruo, Kikuchi, Katsuya, Aoyagi, Masahiro, Kikuchi, Hidekazu, Yanagisawa, Azusa, Nakamura, Akio

    المصدر: 2016 IEEE International 3D Systems Integration Conference (3DIC) 3D Systems Integration Conference (3DIC), 2016 IEEE International. :1-4 Nov, 2016

    Relation: 2016 IEEE International 3D Systems Integration Conference (3DIC)

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  9. 9
    مؤتمر
    3 Dimensional stacked pixel detector and sensor technology using less than 3-μmφ robust bump junctions

    المؤلفون: Motoyoshi, Makoto, Yanagimura, Kohki, Fushimi, Taikoh, Takanohashi, Junichi, Murugesan, Mariappan, Aoyagi, Masahiro, Koyanagi, Mitsumasa

    المصدر: 2016 IEEE International 3D Systems Integration Conference (3DIC) 3D Systems Integration Conference (3DIC), 2016 IEEE International. :1-4 Nov, 2016

    Relation: 2016 IEEE International 3D Systems Integration Conference (3DIC)

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  10. 10
    مؤتمر
    High frequency performance characterization of super-fine inkjet printed silver traces

    المؤلفون: Lim, Ying Ying, Aoyagi, Masahiro, Goh, Yee Mey, Liu, Changqing

    المصدر: 2016 IEEE CPMT Symposium Japan (ICSJ) CPMT Symposium Japan (ICSJ), 2016 IEEE. :239-242 Nov, 2016

    Relation: 2016 IEEE CPMT Symposium Japan (ICSJ)

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