المؤلفون: Phommahaxay, Alain, Kennes, Koen, Podpod, Arnita, Brems, Steven, Slabbekoorn, John, Sleeckx, Erik, Huyghebaert, Cedric, Asselberghs, Inge, Miller, Andy, Beyer, Gerald, Radu, Iuliana, Beyne, Eric, Guerrero, Alice, Prenger, Luke, Yess, Kim, Arnold, Kim, Tussing, Sebastian, Spiess, Walter, Rapps, Thomas, Lutter, Stefan

المصدر: 2019 International Wafer Level Packaging Conference (IWLPC) Wafer Level Packaging Conference (IWLPC), 2019 International. :1-8 Oct, 2019

Relation: 2019 International Wafer Level Packaging Conference (IWLPC)

المؤلفون: Podpod, Arnita, Phommahaxay, Alain, Bex, Pieter, Kennes, Koen, Bertheau, Julien, Arumugam, Hariharan, Cochet, Tom, Rebibis, Kenneth, Sleeckx, Erick, Miller, Andy, Beyer, Gerald, Beyne, Eric, Guerrero, Alice, Liu, Xiao, Wu, Qi, Yess, Kim, Arnold, Kim

المصدر: 2019 International Wafer Level Packaging Conference (IWLPC) Wafer Level Packaging Conference (IWLPC), 2019 International. :1-6 Oct, 2019

Relation: 2019 International Wafer Level Packaging Conference (IWLPC)

المؤلفون: Podpod, Arnita, Phommahaxay, Alain, Bex, Pieter, Slabbekoorn, John, Bertheau, Julien, Salahoueldhadj, Abdellah, Sleeckx, Erik, Miller, Andy, Beyer, Gerald, Beyne, Eric, Guerrero, Alice, Yess, Kim, Arnold, Kim

المصدر: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :340-345 May, 2019

Relation: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

المؤلفون: Phommahaxay, Alain, Podpod, Arnita, Slabbekoorn, John, Sleeckx, Erik, Beyer, Gerald, Beyne, Eric, Guerrero, Alice, Bai, Dongshun, Arnold, Kim

المصدر: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2018 IEEE 68th. :985-992 May, 2018

Relation: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC)

المؤلفون: Phommahaxay, Alain, Jourdain, Anne, Potoms, Goedele, Verbinnen, Greet, Sleeckx, Erik, Beyer, Gerald, Beyne, Eric, Guerrero, Alice, Bai, Dongshun, Yess, Kim, Arnold, Kim

المصدر: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th. :740-745 May, 2017

Relation: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)

المؤلفون: Phommahaxay, Alain, Potoms, Goedele, Verbinnen, Greet, Sleeckx, Erik, Beyer, Gerald, Beyne, Eric, Guerrero, Alice, Bai, Dongshun, Liu, Xiao, Yess, Kim, Arnold, Kim, Spiess, Walter, Griesbach, Tim, Rapps, Thomas, Lutter, Stefan

المصدر: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th. :1685-1690 May, 2016

Relation: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC)

المؤلفون: Jourdain, Anne, Phommahaxay, Alain, Velenis, Dimitrios, Guerrero, Alice, Bai, Dongshun, Yess, Kim, Arnold, Kim, Miller, Andy, Rebibis, Kenneth, Beyer, Gerald, Beyne, Eric

المصدر: 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th. :893-898 May, 2015

Relation: 2015 IEEE 65th Electronic Components and Technology Conference (ECTC)

المؤلفون: Gómez-Mejia, Alejandro, Arnold, Kim, Bär, Julian, Singh, Kapil Dev, Scheier, Thomas C., Brugger, Silvio D., Zinkernagel, Annelies S., Sinues, Pablo

المصدر: In iScience 21 October 2022 25(10)

المؤلفون: Jourdain, Anne, Phommahaxay, Alain, Verbinnen, Greet, Guerrero, Alice, Bailey, Susan, Privett, Mark, Arnold, Kim, Miller, Andy, Rebibis, Kenneth, Beyer, Gerald, Beyne, Eric

المصدر: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th. :894-898 May, 2014

Relation: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC)

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