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1مؤتمر
المؤلفون: Lin, Xi-Wei, Amoroso, Salvatore Maria, Lee, Ko-Hsin, Ke, Meng Hsuan, Gunst, Tue, Tikhomirov, Pavel, Asenov, Plamen
المصدر: 2024 IEEE International Memory Workshop (IMW) Memory Workshop (IMW), 2024 IEEE International. :1-4 May, 2024
Relation: 2024 IEEE International Memory Workshop (IMW)
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2مؤتمر
المؤلفون: Liu, Leitao, Fang, Jingtian, Pal, Ashish, Asenov, Plamen, Bajaj, Mohit, Deng, Bei, Lin, Xi-Wei, Mahapatra, Souvik, Kengeri, Subi, Bazizi, El Mehdi
المصدر: 2024 IEEE International Reliability Physics Symposium (IRPS) International Reliability Physics Symposium (IRPS), 2024 IEEE. :7B.5-1-7B.5-6 Apr, 2024
Relation: 2024 IEEE International Reliability Physics Symposium (IRPS)
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3مؤتمر
المؤلفون: Moroz, Victor, Svizhenko, Alexei, Choi, Munkang, Asenov, Plamen, Lee, Jaehyun
المصدر: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) VLSI Technology and Circuits (VLSI Technology and Circuits), 2023 IEEE Symposium on. :1-2 Jun, 2023
Relation: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)
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4مؤتمر
المؤلفون: Moroz, Victor, Kawa, Jamil, Lin, Xi-Wei, Brown, Andrew R., Asenov, Plamen, Lee, Jaehyun, Bajaj, Mohit, Michalak, Tyler, Riddet, Craig, Svizhenko, Alexei, Hentschke, Renato, Smidstrup, Soren
المصدر: 2021 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) Simulation of Semiconductor Processes and Devices (SISPAD), 2021 International Conference on. :107-110 Sep, 2021
Relation: 2021 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)
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5مؤتمر
المؤلفون: Amoroso, Salvatore Maria, Asenov, Plamen, Lee, Jaehyun, Brown, Andrew R., Lin, Xi-Wei, Moroz, Victor, Kao, Ethan
المصدر: 2021 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) Simulation of Semiconductor Processes and Devices (SISPAD), 2021 International Conference on. :188-191 Sep, 2021
Relation: 2021 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)
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6مؤتمر
المؤلفون: Aboud, Shela, Gunst, Tue, Cobb, Jonathan, Huang, Joanne, Asenov, Plamen, Arcisauskaite, Vaida
المصدر: 2021 IEEE International Interconnect Technology Conference (IITC) Interconnect Technology Conference (IITC), 2021 IEEE International. :1-3 Jul, 2021
Relation: 2021 IEEE International Interconnect Technology Conference (IITC)
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7مؤتمر
المؤلفون: Asenov, Plamen, Amoroso, Salvatore M., Lee, Jaehyun, Corsetti, Fabiano, Vancraeyveld, Pieter, Smidstrup, Soren, Lin, Xi-Wei, Moroz, Victor
المصدر: 2021 5th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) Electron Devices Technology & Manufacturing Conference (EDTM), 2021 5th IEEE. :1-3 Apr, 2021
Relation: 2021 5th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)
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8مؤتمر
المؤلفون: Amoroso, Salvatore Maria, Lee, Jaehyun, Brown, Andrew R., Asenov, Plamen, Lin, Xi-Wei, Moroz, Victor, Yang, Thomas
المصدر: 2020 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) Simulation of Semiconductor Processes and Devices (SISPAD), 2020 International Conference o. :35-38 Sep, 2020
Relation: 2020 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)
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9مؤتمر
المؤلفون: Brown, Andrew R., Wang, Liping, Asenov, Plamen, Klupfel, Fabian J., Cheng, Binjie, Martinie, Sebastien, Rozeau, Olivier, Barraud, Sylvain, Barbe, Jean-Charles, Millar, Campbell, Lorenz, Jurgen K.
المصدر: 2019 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) Simulation of Semiconductor Processes and Devices (SISPAD), 2019 International Conference on. :1-4 Sep, 2019
Relation: 2019 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)
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10مؤتمر
المؤلفون: Ma, Terry, Moroz, Victor, Borges, Ricardo, Sayed, Karim El, Asenov, Plamen, Asenov, Asen
المصدر: 2016 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) Simulation of Semiconductor Processes and Devices (SISPAD), 2016 International Conference on. :335-339 Sep, 2016
Relation: 2016 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)