المؤلفون: Sharar, Darin J., Wilson, Adam A., Leff, Asher, Smith, Andrew, Atli, K. Can, Elwany, Alaa, Arroyave, Raymundo, Karaman, Ibrahim

المصدر: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2020 19th IEEE Intersociety Conference on. :821-826 Jul, 2020

Relation: 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)